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LED bulb lamp for conducting cooling through surfaces of lampshade and lamp body in combined manner

A technology of LED bulb lamps and LED chips, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc., can solve the problem that the total power and lumens of LED bulb lamps cannot be further increased , Restricting the overall heat dissipation efficiency, blocking the terminal link and other issues, to achieve the effect of lowering the temperature, lowering the cost and strengthening the natural convection

Inactive Publication Date: 2017-05-10
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small heat dissipation area provided by the lamp body, the terminal link of the heat dissipation process is blocked, which restricts the improvement of the overall heat dissipation efficiency, so that the total power and lumens of the LED bulb cannot be further increased.

Method used

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  • LED bulb lamp for conducting cooling through surfaces of lampshade and lamp body in combined manner
  • LED bulb lamp for conducting cooling through surfaces of lampshade and lamp body in combined manner
  • LED bulb lamp for conducting cooling through surfaces of lampshade and lamp body in combined manner

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Embodiment Construction

[0026] The heat dissipation principle of the present invention is that the heat generated by the LED chip 2 is conducted to the support 3 through heat conduction, and then the support 3 conducts heat through three paths: the support 3 produces a chimney effect, which enhances the natural convection in the bulb, thereby transferring heat through natural convection. To the glass lampshade 1; the bracket 3 directly transfers heat to the glass lampshade 1 through heat radiation; the bracket 3 conducts the heat to the lamp body 8 through the foot 5 at the bottom, and radiates from the outer surface of the lamp body 8 to the environment.

[0027] Refer to attached figure 1 , 2 , 3, that is, four foot styles, an LED bulb lamp that uses the combined heat dissipation of the lampshade and the surface of the lamp body, including glass lampshade 1, LED chip 2, bracket 3, hole 4, foot 5, base 6, and drive circuit 7. Lamp body 8 and lamp holder 9. A closed lamp body 8 is provided on the l...

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Abstract

The invention discloses an LED bulb lamp for conducting cooling through surfaces of a lampshade and a lamp body in a combined manner. The LED bulb lamp comprises the glass lampshade, LED chips, a support, holes, bottom feet, a base, a drive circuit, the lamp body and a lamp holder. The closed lamp body is arranged above the lamp holder, the drive circuit is arranged in the lamp holder, and the base is arranged outside the lamp holder. The support is erected on the base. The LED chips are attached to the surface of the support. The glass lampshade is arranged outside the support and is arranged on the lamp body in a covering manner. The support is an eight-fan structure formed by folding sheets, the upper portion of the support is small, the lower portion of the support is large, gaps are formed in the bottom, the top is opened, and the shape similar to a hollow eight-edge column and eight-edge table combined body is formed. The lower portion of the support is bent outwards by 90 degrees and is connected to the base through heat-conducting glue or welding. The natural convection of gas inside the bulb is enhanced through the chimney effect of the support, heat is effectively transmitted to the lampshade, and the environment is cooled by sufficiently using the surface of the lampshade. The LED bulb lamp is particularly suitable for manufacturing small-power LED bulb lamps.

Description

technical field [0001] The invention belongs to the technical field of LED energy-saving lamps, and in particular relates to a heat dissipation structure of an LED bulb lamp which can simultaneously utilize a lampshade and a surface of a lamp body for heat dissipation. Background technique [0002] As we all know, LED lamps have low energy consumption and long service life. They are the next-generation lighting technology that can replace existing incandescent and fluorescent lamps, and their market share is rapidly increasing. However, compared with traditional incandescent lamps and fluorescent lamps, LED chips are not resistant to high temperatures, and their lifespan and luminous efficiency decrease rapidly as the temperature of the semiconductor PN junction rises. Therefore, the heat dissipation packaging technology of LED lamps is particularly important. For LED bulbs, due to their small size and strict cost control, complex active cooling technologies cannot be used,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/232F21V29/503F21V29/83F21V29/89F21Y115/10F21Y107/40
CPCF21V29/503F21V29/83F21V29/89
Inventor 冯上升孙山有铭史萌卢天健
Owner XI AN JIAOTONG UNIV
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