Method for preparing temperature-pressure sensor, temperature-pressure sensor structure and temperature-pressure measuring system and method

A pressure sensor and pressure technology, applied in the field of temperature-pressure sensor preparation, can solve the problems of complex installation, low reliability of temperature and pressure measurement systems, and low pressure accuracy.

Active Publication Date: 2017-05-10
SHENZHEN UNIV
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Problems solved by technology

[0005] The invention provides a preparation method and structure of a temperature-pressure sensor and a temperature-pressure measurement system and method, aiming to solve the problem of high process complexity of sensor processing, complicated installation, low precision of detected pressure, and problems of the temperature and pressure measurement system. The problem of low reliability

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  • Method for preparing temperature-pressure sensor, temperature-pressure sensor structure and temperature-pressure measuring system and method
  • Method for preparing temperature-pressure sensor, temperature-pressure sensor structure and temperature-pressure measuring system and method

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[0019] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0020] see figure 1 , figure 1 It is a schematic flow diagram of a method for preparing a temperature-pressure sensor provided in the first embodiment of the present invention, figure 1 The preparation method of the shown temperature-pressure sensor mainly includes the following steps:

[0021] S101. Fusion the flat end face of the single-...

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Abstract

The invention provides a method for preparing a temperature-pressure sensor, a temperature-pressure sensor structure and a temperature-pressure measuring system and method. The method for preparing a temperature-pressure sensor comprises the following steps: fusion splicing the flat end face of a single-mode fiber and the flat end face of a quartz glass tube and cutting the quartz glass tube at a position a preset length close to a fusion splicing port, covering the cutting port of the quartz glass tube with the preset length with the spherical surface of a fiber bubble, fusion splicing the joint of the fiber bubble and the cutting port, cutting the spherical surface of the fiber bubble along a direction in parallel with the cutting port in order that the quartz glass tube with the preset length and the spherical surface of the fiber bubble form a Fabry-Perot interference cavity with the preset length, and making a fiber bragg grating for temperature detection in the single-mode fiber connected with the Fabry-Perot interference cavity by using laser. The method simplifies the process complexity and installation complexity of the temperature-pressure sensor, improves pressure detection accuracy, and enhances the reliability of a temperature and measurement system.

Description

technical field [0001] The invention belongs to the field of optical fiber sensors, and in particular relates to a preparation method and structure of a temperature-pressure sensor and a temperature-pressure measurement system and method. Background technique [0002] In optics, the Fabry–Pérot interferometer (FPI) structure is applied to various optical fiber sensors, which can greatly improve the sensing accuracy. [0003] In practical applications, methods such as chemical etching and coating high reflective films on the end faces of optical fibers can be used to make FPI optical fiber sensors. [0004] However, the existing FPI fiber optic sensors generally can only detect one physical parameter, such as temperature or pressure. If temperature and pressure are to be measured at the same time, it is necessary to install temperature and pressure sensing elements in the sensor at the same time, which will increase the sensor processing. process complexity and installation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02G01D5/353
CPCG01D5/35312G01D5/35316G01D21/02
Inventor 刘申王义平廖常锐王英李自亮张岩付彩玲杨凯明
Owner SHENZHEN UNIV
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