Forming method and array substrate of test pads
A technology for testing pads and array substrates, used in semiconductor/solid-state device testing/measurement, electrical components, electrical solid-state devices, etc. Effect
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[0050] see figure 1 , is a schematic flowchart of the implementation of the method for forming the test pad provided by the embodiment of the present invention.
[0051] The method for forming the test pad includes:
[0052] In step S101, a plurality of test pads arranged at intervals are formed on the array substrate;
[0053] In some embodiments, for the display panel of the mobile phone, a plurality of test pads arranged at intervals are formed on the side of the array substrate. For example, a plurality of test pads arranged at intervals are formed on the upper and lower sides of the array substrate, such as image 3 shown.
[0054] In some embodiments, for a liquid crystal display panel, a plurality of test pads arranged at intervals are formed around the array substrate, such as Figure 4 shown.
[0055] In step S102, connecting a plurality of the test pads, so that each of the test pads can achieve charge sharing;
[0056] In the embodiment of the present inventio...
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