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LED chip and method for manufacturing same

A technology of LED chips and manufacturing methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve problems such as accelerated device degradation, high current density, and device failure, and achieve the effects of optimized geometry, uniform current distribution, and low cost

Inactive Publication Date: 2017-05-10
SHENZHEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

(2) The current density in the local area is high, so that the electromigration of the metal is more serious in this local area, which accelerates the degradation of the device
In addition, this current crowding effect will become more serious as the device ages, forming a vicious circle, and eventually causing the device to fail

Method used

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  • LED chip and method for manufacturing same
  • LED chip and method for manufacturing same
  • LED chip and method for manufacturing same

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] figure 2 It is a schematic structural diagram of an LED chip according to an embodiment of the present invention. Such as figure 2 As shown, the LED chip 20 includes: a substrate 21; a first semiconductor layer 22 arranged on the substrate 21, wherein a groove 23 is arranged on the first semiconductor layer 22, and a first electrode 24 is arranged in the groove 23; The second semiconductor layer 25 on the first semiconductor layer 22...

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Abstract

The invention discloses an LED chip and a method for manufacturing the same. The LED chip includes a substrate; a first semiconductor layer disposed on the substrate, wherein the first semiconductor layer is provided with a groove in which a first electrode is disposed; a second semiconductor layer disposed on the first semiconductor layer; and a second electrode disposed on the second semiconductor layer. By the above method, the method can optimize the geometrical shapes of the electrodes, makes current distribution more uniform, solves a current overcrowding problem, and is simple in process and low in cost.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to an LED chip and a manufacturing method thereof. Background technique [0002] So far, it is still a worldwide problem recognized by the industry that the luminous efficacy of light emitting diodes (LEDs) will decrease under high current density. The mechanism of the LED chip emitting light is that when the current passes through the active area of ​​the LED chip, holes and electrons radiate and recombine to emit light. The LED chip is basically a horizontal structure, and the two electrodes of the LED chip are on the same side of the LED chip. The lateral flow of current in n- and p-type confinement layers is not equal, and the problem of uneven lateral current distribution will occur. Where the current density is high, there is corresponding heat accumulation, and as the current input to the chip increases, this tendency will continue to increase, thereby reducing the luminous ef...

Claims

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Application Information

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IPC IPC(8): H01L33/38H01L33/02H01L33/20H01L33/00
CPCH01L33/005H01L33/007H01L33/02H01L33/20H01L33/38H01L33/382H01L33/48
Inventor 柴广跃罗剑生刘文陈祖军刘志慧
Owner SHENZHEN UNIV