Microphone system and amplifying circuit

Abstract

The invention discloses a microphone system and an amplifying circuit. The microphone system comprises a sensitive structure, the amplifying circuit comprises a buffer circuit used for performing buffer according to a first voltage signal output by the sensitive structure to obtain a second voltage signal; and a conditioning circuit used for receiving the second voltage signal, wherein a part of elements in the amplifying circuit form a passive low-pass filter structure, and the frequency characteristics of the passive low-pass filter structure provide correction for the frequency characteristic of the microphone system in a target band. Compared with the prior art, the embodiment of the invention further improves the signal-to-noise ratio of the microphone system while avoiding increasing the processing difficulty, improves the smoothness of the sensitivity of the system in the band, and meanwhile has the advantages of convenience and low cost.

Description

technical field [0001] The invention relates to the field of microphones, in particular to a microphone system and an amplifying circuit. Background technique [0002] Micro-Electro-Mechanical System (MEMS) is developed on the basis of semiconductor manufacturing technology and integrates technologies such as lithography, corrosion, thin film, silicon micromachining, non-silicon micromachining and precision machining. And realize the high-tech electro-mechanical system. MEMS systems generally include a micromechanically sensitive structure and associated circuitry for converting other physical signals into electrical signals. In order to meet the increasing material and cultural needs of the people, the volume, cost, sensitivity, linearity and other indicators of the MEMS system are constantly optimized and improved. [0003] MEMS microphones are widely used in various electronic devices, such as mobile phones, MP3 players, recorders, and monitoring equipment, due to their...

AI Technical Summary

Problems solved by technology

However, due to the limitations of package size and sensitive structure processing technology, the existing technology has certain difficulties in implementation

For example, as the size of the package becomes smaller and smaller, the range in which the volume of the back cavity of the sensitive structure can be increased becomes more and more limited; the method of changing the parameters of the sensitive structure by reducing the thickness of the diaphragm of the sensitive structure will also bring new benefits to the MEMS processing factory. very difficult to process

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