Liquid-cooled board card module for multipoint temperature monitoring
A multi-point temperature and board technology, applied in the computer field, can solve the problems of complexity, different heating power, different sizes, etc., and achieve the effects of high structural integration, good heat dissipation effect and strong versatility
Active Publication Date: 2017-05-24
SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST
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Problems solved by technology
[0002] In the prior art, in order to solve the heat dissipation problem of the chips on the printed board, a liquid cold plate is usually used as a heat dissipation tool, and the liquid cold plate is in contact with the chip that generates heat on the printed board, and the heat is taken away by heat conduction. The existing problem is that any The heating power of a chip on a printed board is different. How to monitor the working temperature of each chip in real time during the working process is a more complicated issue. In addition, there are many chips on the printed board and their sizes are different. Components currently do not have their own temperature monitoring function, especially some heating devices installed on printed boards, such as heating tubes, heating resistors and power diodes, etc. How to monitor and solve the heat dissipation problem of chips and heating devices on printed boards , is a technical problem that computer technology urgently needs to solve
Method used
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[0019] refer to figure 1 , the present invention includes a flow channel cover plate 1, a cold plate module 2, a sensor flexible component 3, a heat-conducting colloid 4, a heat-conducting copper plate 5, and a circuit board 6;
[0020] refer to figure 1 , figure 2 , image 3 , the cold plate module 2 is a module part provided with a flow channel 21, a liquid inlet 22, and a liquid outlet 23, and the outer side of the module is provided with a puller 24 and a wedge-shaped strip 25;
[0021] refer to figure 1 , Figure 4 , the sensor flexible assembly 3 is a flexible printed board 31 provided with a sensor signal socket 33, the flexible printed board 31 is provided with a plurality of heat conduction nodes, and each heat conduction node is provided with a temperature sensor 32;
[0022] refer to figure 1 , Figure 6 , the heat-conducting copper plate 5 is provided with several protrusions 51;
[0023] refer to figure 1 , Figure 7 , the circuit board 6 is a printed b...
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The invention discloses a liquid-cooled board card module for multipoint temperature monitoring. The liquid-cooled board card module comprises a runner cover plate, a cooling board module, a sensor flexible assembly, a heat-conducting colloid, a heat-conducting copper plate and a circuit board card. The liquid-cooled board card module provided by the invention adopts a structure combining the cooling board module, the sensor flexible assembly, the heat-conducting colloid, the heat-conducting copper plate and the circuit board card, wherein a sensing signal plug of the circuit board card is connected with a sensing signal socket of the sensor flexible assembly in a plug-in way; a plurality of heating devices of the circuit board card correspond to a plurality of bulges of the heat-conducting copper plate and heat-conducting nodes of the sensor flexible assembly in a one-to-one correspondence way. The liquid-cooled board card module for multipoint temperature monitoring provided by the invention solves the problem of carrying out multipoint monitoring and heat radiating on a chip and the heating devices on a printed board, and has the advantages of high structure integration level, multiple monitoring points, good heat radiating effect and high universality.
Description
technical field [0001] The invention relates to the heat dissipation of printed board chips in the technical field of computers, in particular to a liquid-cooled board module for multi-point temperature monitoring. Background technique [0002] In the prior art, in order to solve the heat dissipation problem of the chips on the printed board, a liquid cold plate is usually used as a heat dissipation tool, and the liquid cold plate is in contact with the chip that generates heat on the printed board, and the heat is taken away by heat conduction. The existing problem is that any The heating power of a chip on a printed board is different. How to monitor the working temperature of each chip in real time during the working process is a more complicated issue. In addition, there are many chips on the printed board and their sizes are different. Components currently do not have their own temperature monitoring function, especially some heating devices installed on printed boards,...
Claims
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IPC IPC(8): H05K7/20G01K13/00G01K1/14
CPCH05K7/20218H05K7/205H05K7/20509G01K1/14G01K13/00
Inventor 金旸霖谭伟
Owner SHANGHAI AEROSPACE SCI & IND ELECTRIC APPLIANCE RES INST
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