Liquid-cooled board card module for multipoint temperature monitoring

Abstract

The invention discloses a liquid-cooled board card module for multipoint temperature monitoring. The liquid-cooled board card module comprises a runner cover plate, a cooling board module, a sensor flexible assembly, a heat-conducting colloid, a heat-conducting copper plate and a circuit board card. The liquid-cooled board card module provided by the invention adopts a structure combining the cooling board module, the sensor flexible assembly, the heat-conducting colloid, the heat-conducting copper plate and the circuit board card, wherein a sensing signal plug of the circuit board card is connected with a sensing signal socket of the sensor flexible assembly in a plug-in way; a plurality of heating devices of the circuit board card correspond to a plurality of bulges of the heat-conducting copper plate and heat-conducting nodes of the sensor flexible assembly in a one-to-one correspondence way. The liquid-cooled board card module for multipoint temperature monitoring provided by the invention solves the problem of carrying out multipoint monitoring and heat radiating on a chip and the heating devices on a printed board, and has the advantages of high structure integration level, multiple monitoring points, good heat radiating effect and high universality.

Description

technical field [0001] The invention relates to the heat dissipation of printed board chips in the technical field of computers, in particular to a liquid-cooled board module for multi-point temperature monitoring. Background technique [0002] In the prior art, in order to solve the heat dissipation problem of the chips on the printed board, a liquid cold plate is usually used as a heat dissipation tool, and the liquid cold plate is in contact with the chip that generates heat on the printed board, and the heat is taken away by heat conduction. The existing problem is that any The heating power of a chip on a printed board is different. How to monitor the working temperature of each chip in real time during the working process is a more complicated issue. In addition, there are many chips on the printed board and their sizes are different. Components currently do not have their own temperature monitoring function, especially some heating devices installed on printed boards,...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, in order to solve the heat dissipation problem of the chips on the printed board, a liquid cold plate is usually used as a heat dissipation tool, and the liquid cold plate is in contact with the chip that generates heat on the printed board, and the heat is taken away by heat conduction. The existing problem is that any The heating power of a chip on a printed board is different. How to monitor the working temperature of each chip in real time during the working process is a more complicated issue. In addition, there are many chips on the printed board and their sizes are different. Components currently do not have their own temperature monitoring function, especially some heating devices installed on printed boards, such as heating tubes, heating resistors and power diodes, etc. How to monitor and solve the heat dissipation problem of chips and heating devices on printed boards , is a technical problem that computer technology urgently needs to solve

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