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Design method and structure of steel mesh hole of 0.5 mm pitch CSP element

A design method and stencil technology, applied in printing, printing plate preparation, etc., can solve problems such as the rise of defective solder joints, and the stencil opening can no longer be reduced, so as to achieve the effect of improving yield and reliability

Inactive Publication Date: 2017-05-31
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] At this time, the opening of the stencil can no longer be reduced, and if the defect of virtual welding is reduced, it will increase significantly;

Method used

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  • Design method and structure of steel mesh hole of 0.5 mm pitch CSP element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A design method for stencil openings of 0.5mm pitch CSP components, when the method uses 0.5 pitch CSP components, the corresponding solder paste printing stencil openings are square.

Embodiment 2

[0035] Such as figure 1 As shown, on the basis of Example 1, the side length of the square opening of the solder paste printing stencil described in this example is 0.22 mm.

[0036] This design breaks the usual circular opening method in the industry, and provides the recommended size of the golden section size, improving the yield and reliability of product manufacturing.

Embodiment 3

[0038] On the basis of embodiment 2, the specific implementation process of the method described in this embodiment is as follows:

[0039] 1) Select a steel sheet with a thickness of 0.08mm to make a solder paste printing stencil;

[0040] 2), Open a 0.22mm square hole at the 0.5 pitch CSP position;

[0041] 3) Normal SMT production of circuit boards;

[0042] 4) Detect the welding effect through X-RAY equipment.

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Abstract

The invention discloses a design method for a steel mesh hole of a 0.5 mm pitch CSP element. According to the design method, when the 0.5 mm pitch CSP element is used, steel mesh hole for solder paste printing is square correspondingly. The design method breaks through the way that round holes are usually adopted in the industry, the suggested golden section dimension is provided, and the yield and reliability of product manufacturing are improved.

Description

technical field [0001] The invention relates to the technical field of PCB design and processing, in particular to a design method and structure of steel mesh openings for 0.5mm pitch CSP components. Background technique [0002] With the continuous progress of the times, the demand for electronic products used by human beings is becoming stronger and stronger. Commercial electronic products such as servers are developing rapidly towards low power consumption and miniaturized applications. From the initial large-scale products to the current miniaturized servers, more and more server electronic products are highly integrated and high-density, which makes electronic Devices become more miniaturized. The miniaturization of electronic devices is a major topic in server R&D and server manufacturing, and at the same time brings greater challenges. [0003] With the development of the electronics industry, electronic components tend to be highly integrated, and the volume of com...

Claims

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Application Information

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IPC IPC(8): B41C1/14
CPCB41C1/14
Inventor 张化文
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD