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Method for extracting mesh graph from vector graph and performing filling through quick computing

A vector graphics, fast computing technology, applied in computing, 2D image generation, details involving image processing hardware, etc., can solve the problems of low system production capacity, high cost, low performance, etc., and achieve the effect of improving processing performance and production capacity

Inactive Publication Date: 2017-05-31
江苏维普光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. FPGA is a special-purpose hardware, which needs to be customized and developed for specific projects, and the cost is high;
[0005] 2. Triangular decomposition and filling of polygons, the performance is relatively low, resulting in low system productivity

Method used

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  • Method for extracting mesh graph from vector graph and performing filling through quick computing
  • Method for extracting mesh graph from vector graph and performing filling through quick computing
  • Method for extracting mesh graph from vector graph and performing filling through quick computing

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Embodiment Construction

[0019] The present invention will now be described in further detail with reference to the accompanying drawings and preferred embodiments. These drawings are all simplified schematic diagrams, which merely illustrate the basic structure of the present invention in a schematic manner, so they only show the structures related to the present invention.

[0020] Such as figure 1 As shown, an embodiment of a device for extracting grid graphics and filling from vector graphics based on GPU rapid calculation, includes a control module 5, a positioning platform 1, a platform controller 7, a synchronization module 6, a microscope 3, and a camera 4, real-time Focus module 8.

[0021] The control module 5 completes the control of the motion platform (including the setting of the motion track of the motion platform, the setting of the motion speed and acceleration), the collection of images, the rasterization and filling of vector diagrams, and the detection of defects. Multiple GPUs can be i...

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PUM

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Abstract

The invention relates to a method for extracting a mesh graph from a vector graph and performing filling through quick computing. The method comprises the following steps of reading input GDS vector graph information by a control module and analyzing a corresponding layer of a GDS file; performing conversion defined in the GDS vector graph file on a vector point, and forming absolute coordinates of the vector point of the GDS vector graph file; meshing the vector graph by the control module according to a view field size and a lens magnification rate of a collection module, and according to the absolute coordinates of the vector point, performing division and clipping on a polygon where the vector point is located according to coordinates of meshes; and obtaining polygon coordinates of meshes of a stripe once by the control module, and sending the polygon coordinates to a GPU for performing parallel filling. According to the method, a universal GPU computing card is adopted for realizing conversion from the vector graph to a bitmap; a plurality of GPU computing cards can be adopted for cooperative processing according to system demands; and triangular decomposition of the polygon does not need to be carried out in the processing process, so that the processing performance and production capacity of a system are improved.

Description

Technical field [0001] The invention relates to the technical field of semiconductor defect detection / lithography, in particular to a method for quickly calculating and extracting grid patterns from vector patterns and filling. Background technique [0002] In the process of semiconductor lithography / defect inspection, vector graphics (such as GDSII format) need to be converted into bitmaps. For lithography, the bitmaps are written on the mask using photolithography technology. The graphics are copied to the wafer, and the chip is formed after a variety of processes; for semiconductor defect detection, it is necessary to compare the image of the mask / wafer collected from the image sensor (such as a camera) with the bitmap to detect The difference between the captured image and the bitmap, these differences are the defects of the mask / die. [0003] The prior art generally uses FPGA to perform bitmap conversion, and generally first triangulates the polygons in the vector diagram, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T1/20G06T11/00
CPCG06T1/20G06T11/001G06T2200/28
Inventor 刘庄何津张琨刘建明张彦鹏蒋平蒋开
Owner 江苏维普光电科技有限公司
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