LCM (LCD Module) assembly appearance defect detection method based on 3D imaging technology

A defect detection and component technology, applied in image enhancement, image analysis, image data processing and other directions, can solve the problems of high cost, inaccurate inspection results, low efficiency and accuracy, and achieve high accuracy, high inspection efficiency, The effect of saving labor costs

Active Publication Date: 2017-05-31
BEIJING ZHAOWEI XINYUAN COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inspectors are generally young people with good eyesight between the ages of 18 and 24. Using the visual inspection method has a strong personal subjective initiative, and the inspectors work too long, which will cause eye fatigue and make the test results inaccurate. accurate
In addition, a large number of inspectors are required on the production line, which is costly and relatively low in efficiency and accuracy

Method used

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  • LCM (LCD Module) assembly appearance defect detection method based on 3D imaging technology
  • LCM (LCD Module) assembly appearance defect detection method based on 3D imaging technology
  • LCM (LCD Module) assembly appearance defect detection method based on 3D imaging technology

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Experimental program
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Embodiment

[0042] Such as figure 1 with figure 2 As shown, an LCM component shape defect detection method based on 3D imaging technology includes the following steps:

[0043] S1: Use a 3D laser sensor to obtain the original height image of the LCM component, which includes the background area representing the environmental background, the Cover area representing the part of the LCM component covering the peripheral circuit, and the screen area representing the screen portion of the LCM component;

[0044] S2, according to the positional relationship between the 3D laser sensor and the LCM component, the original height image is converted into the first height image representing the true height value of the LCM component, and the background area is filtered out by using the difference in the height value range of the background area, the Cover area and the screen area, Obtain a second height image containing only the Cover area and the screen area;

[0045] S3: Determine whether the shape of ...

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Abstract

The invention relates to an LCM (LCD Module) assembly appearance defect detection method based on a 3D imaging technology and belongs to the field of LCM assembly appearance defect detection. The LCM assembly appearance defect detection efficiency and precision can be improved. According to the method, an original height image of an LCM assembly is obtained through a 3D laser sensor; the image comprises a background area indicating an environment background, a cover area indicating a peripheral circuit cover part, and a screen area indicating a screen part; the original height image is converted into a first height image indicating a true height value of the LCM assembly according to a position relationship between the 3D laser sensor and the LCM assembly; the background area is filtered through utilization of the range difference of the height values of the background area and the cover area and the screen area, thereby obtaining a second height image; and whether a defect exists in the appearance of the LCM assembly or not is judged according to the height values of the cover and the screen area in the second height image. The method is used for carrying out LCM assembly appearance defect detection precisely and efficiently instead of manpower.

Description

Technical field [0001] The invention relates to the field of LCM component shape defect detection, in particular to the field of LCM component shape defect detection based on 3D imaging technology. Background technique [0002] In the current production process of LCM (LCD Module, liquid crystal display module) components, the defects in the shape of the LCM component can be distinguished by the height relationship between the Cover (cover) area of ​​the peripheral circuit in the LCM component and the shape of the screen area. The prior art The detection of the height relationship between the Cover area and the screen area in the LCM component is based on the visual method, that is, the binocular recognition method. The inspector observes the height of the Cover area and the screen area of ​​the LCM component through both eyes, and makes two observations. The judgment of the height difference. The inspectors are generally young people with good eyesight between the ages of 18-24...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/136
CPCG06T7/0004G06T2207/30121
Inventor 张莲莲王树雨闫大庆郝立猛朱静杨宗芳纪泽王新新
Owner BEIJING ZHAOWEI XINYUAN COMM TECH
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