A kind of packaging method of diode and diode
A packaging method and diode technology, applied in the field of diodes, can solve the problems of large space occupied by diodes and low packaging efficiency, and achieve the effects of improved packaging efficiency, small occupied space, and simple process flow
Active Publication Date: 2020-01-14
SHENZHEN SIPTORY TECH CO LTD
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Problems solved by technology
[0005] The embodiment of the present invention provides a diode packaging method and the diode, which are used to solve the problems of large footprint and low packaging efficiency of existing diodes
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Embodiment Construction
[0079] The embodiments of the present invention provide a diode packaging method and the diode, which are used to solve the problems of large occupied space and low packaging efficiency of existing diodes.
[0080] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.
[0081] The terms "comprising" and "having" in the description and claims of the present invention and the above drawings, as well as any variations thereof, are intended to cover non-exclusive inclusion, for example, processes, methods, A system, product or device is not n...
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The embodiment of the invention discloses a packaging method for a diode and a diode, aiming to solve the problems that the existing diode occupies large space and the packaging efficiency is low. The packaging method provided by the embodiment of the invention includes: preparing a carrier, and coating at least one surface of the carrier with a surface metal layer; covering the circuit pattern region of the surface metal layer with an anticorrosion film; electroplating the non-circuit pattern region of the surface metal layer to form at least two pads; welding a chip on at least one pad to form a diode template; performing plastic packaging on the diode template with a composite material; drilling blind holes in the vertical direction of the at least two pads, and processing the blind holes to form metallization blind holes, wherein, if the chip is welded on the pad, the chip is welded on the bottom of the corresponding metallization blind hole, and if the chip is not welded on the pad, the pad is welded on the bottom of the corresponding metallization blind hole; and performing pattern manufacturing on the metallization blind holes to form a closed loop of a circuit, thus packaging the diode.
Description
technical field [0001] The invention relates to the field of diodes, in particular to a method for packaging a diode and the diode. Background technique [0002] As electronic products develop toward miniaturization, integration, and popularization, the diodes used in electronic products are also miniaturized. [0003] At present, the diode adopts the traditional packaging method, for example, the chip (full name in English: Chip) is packaged into a diode with certain functions by using money (full name in English: Wire bond, abbreviation: WB). [0004] However, for some miniaturized electronic products integrated with diodes, the diodes packaged by traditional wire bonding take up a lot of space and have low packaging efficiency. Contents of the invention [0005] The embodiments of the present invention provide a diode packaging method and the diode, which are used to solve the problems of large occupied space and low packaging efficiency of existing diodes. [0006] T...
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IPC IPC(8): H01L21/48H01L21/60
CPCH01L21/4846H01L24/81H01L2224/81801
Inventor 黄冕
Owner SHENZHEN SIPTORY TECH CO LTD