Method for verifying center deviation position of dynamic wafer in AWC (Active Wafer Centering) system

Abstract

The invention relates to the technical field of mechanical control, and particularly relates to a method for verifying a center deviation position of a dynamic wafer in an AWC (Active Wafer Centering) system. The method comprises the following steps that: (1) a manipulator moves to a demonstration position above a station, an initial target sphere position is recorded by utilizing a laser tracker, and simultaneously, a current joint value on a demonstration box is recorded; (2) the manipulator drives the wafer to carry out translation, and a joint value on the demonstration box after translation is recorded; (3) the manipulator retracts and lifts the wafer to the demonstration position above the station again, and a new target sphere position is recorded; (4) an offset of a wafer center is detected by utilizing an AWC function; (5) a coordinate system is set up; and (6) according to the coordinate system, wafer deviation results obtained by display of the demonstration box, AWC detection and actual measurement of the laser tracker are respectively calculated and are compared. According to the method disclosed by the invention, the problem of translation of the wafer in the verification test is solved, no instrument or equipment is additionally added to operate the wafer, and verification test efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of mechanical control, in particular to a method for verifying the center deviation position of a dynamic wafer in an AWC system. Background technique [0002] In the manufacturing process of semiconductors, manipulators are usually used between chambers or between stations to complete wafers (wafers refer to silicon wafers used in the production of silicon semiconductor integrated circuits. Because of their circular shape, they are called wafers. round) transmission. In the wafer transfer system, in order to avoid the occurrence of objective factors such as deviation or wafer damage during pick-and-place and improve the accuracy of wafer pick-and-place, it is necessary to design and use the AWC (Active Wafer Centering) system for detection and correction. The AWC system automatically corrects the deviation between the actual center and the teaching center during the movement of the manipulator to ensure th...

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Problems solved by technology

[0005] And because if the wafer is moved artificially, it will inevitably bring about the rotation of the wafer itself. In this case, the Δx and Δy calculated by the external equipment will include the deviation of the rotation of the wafer itself, and the result given by AWC does not include The deviation of the wafer's own rotation

If

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