The invention relates to the technical field of mechanical control, and particularly relates to a method for verifying a center deviation position of a dynamic
wafer in an AWC (Active
Wafer Centering)
system. The method comprises the following steps that: (1) a
manipulator moves to a demonstration position above a
station, an initial target sphere position is recorded by utilizing a
laser tracker, and simultaneously, a current joint value on a demonstration box is recorded; (2) the
manipulator drives the
wafer to carry out translation, and a joint value on the demonstration box after translation is recorded; (3) the
manipulator retracts and lifts the
wafer to the demonstration position above the
station again, and a new target sphere position is recorded; (4) an offset of a wafer center is detected by utilizing an AWC function; (5) a coordinate
system is set up; and (6) according to the coordinate
system, wafer deviation results obtained by display of the demonstration box, AWC detection and actual measurement of the
laser tracker are respectively calculated and are compared. According to the method disclosed by the invention, the problem of translation of the wafer in the
verification test is solved, no instrument or equipment is additionally added to operate the wafer, and
verification test efficiency is improved.