Modular AOI (automated optical inspection) positioning method, system and burning IC (integrated circuit) equipment

A positioning method and positioning system technology, applied in character and pattern recognition, image data processing, instruments, etc., can solve the problem of low IC positioning accuracy

Active Publication Date: 2015-04-08
PROSYST ELECTRONICS TECH
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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a modular AOI positioning method, system and burning IC equipment, aiming to solve the problem of low IC positioning accuracy in the existing IC burning industry

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  • Modular AOI (automated optical inspection) positioning method, system and burning IC (integrated circuit) equipment
  • Modular AOI (automated optical inspection) positioning method, system and burning IC (integrated circuit) equipment
  • Modular AOI (automated optical inspection) positioning method, system and burning IC (integrated circuit) equipment

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Embodiment Construction

[0044] The present invention provides a modularized AOI positioning method, system and IC burning equipment. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0045] see figure 1 , which is a flowchart of a preferred embodiment of the modularized AOI positioning method of the present invention. As shown in the figure, the modular AOI positioning method includes the following steps:

[0046] S101. Load a burnt IC picture, and perform image function adjustment on the burnt IC picture.

[0047] In the embodiment of the present invention, when loading the burning IC picture, by opening four threads, setting the four vertices of the burning IC picture a...

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Abstract

The invention provides a modular AOI (automated optical inspection) positioning method, a modular AOI system and burning IC (integrated circuit) equipment. The burning IC equipment is subjected to IC positioning in a modularization mode, and the modularization refers to the operation that each module for controlling an IC positioning system is packed into a dynamic command library through a certain software development platform, and the positioning operation of IC burning is controlled through calling an interface function of the dynamic command library. The system has the advantages that the multi-direction calculation function is adopted, the detection speed is accelerated, and in addition, the detection precision is improved by adopting a standard image correcting method; meanwhile, through the modular development framework, the verification test time in the development process is also reduced, and the product development speed is accelerated.

Description

technical field [0001] The invention relates to the technical field of IC burning, in particular to a modular AOI positioning method, system and IC burning equipment. Background technique [0002] In the domestic IC programming industry, although the automatic programming industry has been developed for many years, the AOI positioning detection system has not kept up with the international pace, especially in the field of IC testing, the lack of relevant development technicians, the market does not understand AOI testing, Many problems such as low positioning accuracy have always prevented the continuous development and production of this system. The traditional manual inspection method can easily make it difficult for enterprises to check the quality, and at the same time greatly reduce the efficiency of IC output. More seriously, enterprises cannot get more orders and cannot cooperate with higher-end products due to quality problems. For enterprises, this The loss is long...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/32G06T7/00G06F9/445
CPCG06T7/0004G06T7/73G06T2207/10004G06T2207/30148
Inventor 周秋香
Owner PROSYST ELECTRONICS TECH
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