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Radio-frequency LDMOS transistor with overheat protection function

An overheating protection, transistor technology, applied in transistors, electric solid state devices, semiconductor devices, etc., can solve the problems of package incompatibility, increase the complexity of the radio frequency system, increase the cost, etc., and achieve the effect of preventing the device from being damaged by overheating

Active Publication Date: 2017-05-31
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional overheating protection has two forms, 1) consists of an external circuit with a thermal sensor as the core, which increases the complexity of the RF system and increases the cost; 2) integrates the thermal sensor and protection circuit inside the chip, so that Reduced cost, but internal sensors and circuits require independent power supply, which requires additional external power supply pins, which is not compatible with existing packages, and additional power supply in the RF system will also increase the cost

Method used

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  • Radio-frequency LDMOS transistor with overheat protection function
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  • Radio-frequency LDMOS transistor with overheat protection function

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Embodiment Construction

[0026] The following describes the implementation of the present invention through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] A radio frequency LDMOS transistor with overheating protection function includes a SONOS device, an NPN BJT thermal sensor and a radio frequency LDMOS device integrated on the same chip; the gate of the SONOS device stores positive charges; the gate of the SONOS device is connected to The base of the NPN BJT thermal sensor provides a bias for the emission junction of the NPN BJT thermal sensor; the collector of the NPN BJT thermal s...

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Abstract

The invention provides a radio-frequency LDMOS transistor with an overheat protection function. The radio-frequency LDMOS transistor comprises an SONOS device, an NPN BJT heat sensor and a radio-frequency LDMOS device integrated on a same chip, wherein positive charges are stored at a gate of the SONOS device; the gate of the SONOS device is connected to a base of the NPN BJT heat sensor through a metal and provides an emitter junction of the NPN BJT heat sensor with bias; and a collector of the NPN BJT heat sensor is connected to the gate of the LDMOS device and provides the gate of the LDMOS device with a current discharge channel. An overheat protection circuit of the radio-frequency LDMOS device is integrated on the radio-frequency LDMOS chip and an independent power supply pin is not needed, so that the complexity of a radio-frequency system is greatly reduced and the manufacturing cost and the maintenance cost of the radio-frequency system employing the radio-frequency LDMOS device as a core are reduced.

Description

Technical field [0001] This application relates to a semiconductor device, specifically a radio frequency LDMOS transistor with overheating protection function. Background technique [0002] Radio frequency LDMOS (Laterally Double-Diffused Metal Oxide Semiconductors, lateral double diffused transistors) field effect transistor is a wide range of radio frequency devices, with good linearity, high power gain, high withstand voltage, good matching performance, high efficiency and output High power and other advantages. It is widely used in wireless communications, mobile base stations, satellite communications, radar and navigation. [0003] The conventional RF LDMOS structure is as figure 1 Shown. In the application of high-power RF LDMOS devices, the heating of RF LDMOS devices cannot be ignored. If the heat dissipation of the radio frequency system fails or the device works under other poor heat dissipation conditions, the radio frequency LDMOS device is easily burned out due to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02H01L27/06
CPCH01L27/0259H01L27/0623
Inventor 邓小川刘冬冬宋凌云童星万殊燕杨文驰谭犇张波
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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