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Dry and wet machine and production line

An all-in-one, dry-wet technology, applied in semiconductor devices, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as increasing process uncertainty factors and increasing costs

Active Publication Date: 2019-03-19
CHANGZHOU BITAI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This not only increases the cost, but also passes through the manual circulation link in the middle, which increases the uncertainty factor of the process

Method used

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  • Dry and wet machine and production line
  • Dry and wet machine and production line
  • Dry and wet machine and production line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] figure 1 It is a schematic structural diagram of the wet and dry integrated machine provided in Embodiment 1 of the present invention; figure 2 Schematic diagram of the structure of the chip feeder provided by Embodiment 1 of the present invention; image 3 A top view of the structure of the automatic front cleaning machine provided in Embodiment 1 of the present invention; Figure 4 A side view of the structure of the automatic front cleaning machine provided by Embodiment 1 of the present invention; Figure 5 Schematic diagram of the structure of the automatic loading and unloading mechanism provided by Embodiment 1 of the present invention; Figure 6 A schematic structural view of the RIE dry texturing machine provided by Embodiment 1 of the present invention; Figure 7 Schematic diagram of the structure of the automatic stacking machine provided in Embodiment 1 of the present invention; Figure 8 A schematic structural diagram of the flower basket automatic tur...

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Abstract

The invention provides a dry-wet all-in-one machine, which comprises a slice inserting and feeding machine, an automatic front cleaning machine, an automatic feeding and blanking mechanism, an RIE wet-method texturing machine, an automatic lamination stacking machine and a flower basket automatic-rotating mechanism, wherein the slice inserting and feeding machine, the automatic front cleaning machine and the automatic feeding and blanking mechanism are connected in sequence; the RIE wet-method texturing machine and the automatic lamination stacking machine are respectively connected with the automatic feeding and blanking mechanism, and the flower basket automatic-rotating mechanism is arranged between the slice inserting and feeding machine and the automatic front cleaning machine. According to the whole set of equipment provided by the invention, in order to implement a wet-method texturing process of silicon slices, the processes and the technologies such as automatically inserting the silicon slices, performing front cleaning, automatically switching the silicon slice onto the wet-method texturing machine, performing wet-method texturing, and automatically laminating the silicon slices are integrated. The whole set of equipment does not need manual intervention as automatic equipment is used. On the basis, the invention also provides a production line adopting the dry-wet all-in-one machine.

Description

technical field [0001] The invention relates to the field of solar cell manufacturing, in particular to a dry-wet integrated machine and a production line. Background technique [0002] In solar cells, in order to reduce the reflection of silicon wafers on sunlight, light energy is converted into electrical energy as much as possible to improve power generation efficiency. Before the silicon wafer is made into a cell, the surface of the silicon wafer needs to be treated to reduce the reflectivity of light. In the photovoltaic industry, the name of this process is called "texturing process". Because the quality of the texturing process directly affects the conversion efficiency of solar cells, the texturing process is a key process in the production of solar silicon wafers. In recent years, with the sharp reduction in the cost of diamond wire-cut silicon wafers, the ensuing problem is that the surface texturing process of diamond wire-cut polysilicon wafers does not match th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18
CPCH01L31/1876Y02P70/50
Inventor 上官泉元谭兴波杨虎
Owner CHANGZHOU BITAI TECH