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Duplex energy-saving LED semiconductor chip and method for lowering power consumption

A semiconductor and chip technology, applied in the field of electroluminescence and thermoluminescence, can solve the problems of high heat flux density, heat dissipation bottleneck, and high use cost of LED light-emitting chips

Inactive Publication Date: 2017-05-31
王赞
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Problems solved by technology

However, under low voltage and high power conditions, the heat flux density of LED light-emitting chips is as high as 30W / cm 2 The above makes the heat dissipation problem a bottleneck that needs to be solved urgently
Especially for high-power LED planar cluster packaging modules, the cooling method of forced heat exchange will consume a lot of power and increase the cost of use

Method used

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  • Duplex energy-saving LED semiconductor chip and method for lowering power consumption
  • Duplex energy-saving LED semiconductor chip and method for lowering power consumption

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Embodiment Construction

[0008] Hereinafter, the invention will be described more fully with reference to the accompanying drawings, in which an embodiment is shown. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0009] Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0010] Reference attached Figure 1~2 , the realization of the technical solution of the present invention: a dual energy-saving LED semiconductor chip, which is composed of ten parts, which are respectively a DC power supply, a wire, a positive copper electrode, a P-GaN film, a GaN film, an N-GaN film, an N- GaN substrate, HfO2 thin film, P-ZnO thin film, negative copper electrode. ...

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Abstract

The invention relates to a duplex energy-saving LED semiconductor chip which is composed of a direct current power source, a wire, a positive copper electrode, a P-GaN film, a GaN film, a N-GaN film, a N-GaN substrate, a HfO2 film, a P-ZnO film and a negative copper electrode. Electrons are input from the negative copper electrode and composited with holes inside the light-emitting layer HfO2 film on the right side and the light-emitting layer GaN film on the left side respectively, and photons are emitted. On the basis of thermoluminescence principle, the energy of the photons emitted by the HfO2 film is larger than electric field work, and the excessive energy comes from heat released by the light-emitting layer GaN film on the left side. The duplex LED semiconductor chip adopts combination of electroluminescence and thermoluminescence for lowering the power consumption, so that the LED technology is promoted to develop to save energy and lower consumption.

Description

technical field [0001] The invention relates to a dual energy-saving LED semiconductor chip and a method for reducing power consumption, belonging to the fields of electroluminescence and thermoluminescence. Background technique [0002] LED lights mainly use the combination of P-type semiconductor and N-type semiconductor to form a light-emitting heterojunction, and use the principle of recombination of electrons and holes to release photons to achieve light. Compared with incandescent lamps, it has the characteristics of low power consumption, high brightness, small size, easy installation and high reliability. However, under low voltage and high power conditions, the heat flux density of LED light-emitting chips is as high as 30W / cm 2 The above makes the heat dissipation problem a bottleneck to be solved urgently. Especially for high-power LED planar cluster packaging modules, the cooling method of forced heat exchange will consume a lot of power and increase the cost o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/32H01L27/02
CPCH01L27/0207H01L33/32
Inventor 王赞刘自通阮宜武
Owner 王赞
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