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Piezoelectric ceramic actuator piece and preparation method thereof

A technology of piezoelectric ceramic actuation and piezoelectric ceramic sheet, which is applied in the direction of piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc. The performance of the moving piece is unstable and other problems, to achieve the effect of dense and stable connection, stable performance and easy operation

Active Publication Date: 2020-09-25
SUZHOU PANT PIEZOELECTRIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] One of the objects of the present invention is to provide a piezoelectric ceramic actuating piece to solve the piezoelectric ceramic actuating piece in the prior art. Shrinkage occurs in the medium, and the adhesive is easy to age and deform, resulting in the technical problems of unstable performance and poor reliability of the piezoelectric ceramic actuator during use.

Method used

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  • Piezoelectric ceramic actuator piece and preparation method thereof
  • Piezoelectric ceramic actuator piece and preparation method thereof
  • Piezoelectric ceramic actuator piece and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] figure 1 A schematic diagram of the exploded structure of the piezoelectric ceramic actuator piece provided in Embodiment 1 of the present invention; figure 2 for figure 1 The structural schematic diagram of the cross-section of the piezoceramic actuator piece shown; figure 1 and figure 2 As shown, the piezoelectric ceramic actuating piece provided by the embodiment of the present invention includes a first piezoelectric ceramic piece and a toughened ceramic substrate 102, and the first piezoelectric ceramic piece includes a first ceramic piece 101 and is respectively arranged on the first ceramic piece 101. The first external electrode sheet 103 and the first internal electrode sheet 104 on the upper and lower surfaces, the toughened ceramic substrate 102 is arranged below the first internal electrode sheet 104, and the first piezoelectric ceramic sheet and the toughened ceramic substrate 102 are integrally co-fired .

[0034] In the piezoelectric ceramic actuati...

Embodiment 2

[0059] image 3 A schematic diagram of the exploded structure of the piezoelectric ceramic actuator piece provided by Embodiment 2 of the present invention; Figure 4 for image 3 Schematic cross-sectional view of the piezoceramic actuator piece shown. Such as image 3 and Figure 4 As shown, this embodiment also provides a piezoelectric ceramic actuator. This embodiment is a further improvement on the basis of Embodiment 1. The technical solution described in Embodiment 1 also belongs to this embodiment. Embodiment 1 has The described technical solutions will not be described repeatedly.

[0060] The piezoelectric ceramic actuating piece provided in this embodiment also includes a second piezoelectric ceramic piece, and the second piezoelectric ceramic piece includes a second ceramic piece 108 and a second internal electrode piece 109 respectively arranged on the upper and lower surfaces of the second ceramic piece 108 and the second external electrode sheet 110 , the se...

Embodiment 3

[0083] Figure 5 A schematic diagram of the exploded structure of the piezoelectric ceramic actuating piece provided in Embodiment 3 of the present invention; Figure 5As shown, the difference between this embodiment and embodiment 2 is that in embodiment 2, a third pad 112, a fourth pad 113 and a fifth pad 114 are provided, while this embodiment is provided with a sixth pad pad 117, the seventh pad 118, the eighth pad 119 and the ninth pad 120, wherein the sixth pad 117 is connected to the first external electrode sheet 103, and the seventh pad 118 is connected to the first internal electrode sheet 104 , the eighth pad 119 is connected to the second internal electrode sheet 109 , and the ninth pad 120 is connected to the second external electrode sheet 110 .

[0084] By setting the sixth bonding pad 117, the seventh bonding pad 118, the eighth bonding pad 119 and the ninth bonding pad 120, the piezoelectric ceramic actuating sheet provided in this embodiment can be connected...

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Abstract

The invention provides a piezoelectric ceramic actuating sheet and a preparation method thereof, which relate to the technical field of piezoelectric ceramic elements, and include a first piezoelectric ceramic sheet and a toughened ceramic substrate, and the toughened ceramic substrate is arranged on the first Below the piezoelectric ceramic sheet, the first piezoelectric ceramic sheet and the toughened ceramic substrate are integrally co-fired, and the toughened ceramic substrate is used as a supporting substrate to form a piezoelectric ceramic induction joint with the first piezoelectric ceramic sheet. The moving piece solves the technical problems of the piezoelectric ceramic actuating piece in the prior art, the piezoelectric ceramic piece and the supporting substrate are connected by an adhesive, and the performance is unstable and the reliability is poor during use due to the aging of the adhesive. The connection between the first piezoelectric ceramic sheet and the toughened ceramic substrate is dense and stable, and the piezoelectric ceramic actuator sheet has stable performance and good reliability during use.

Description

technical field [0001] The invention relates to the technical field of piezoelectric ceramic elements, in particular to a piezoelectric ceramic actuator piece and a preparation method thereof. Background technique [0002] With the development of electronic technology, piezoelectric ceramic actuators formed by the direct piezoelectric effect or inverse piezoelectric effect of piezoelectric technology have been widely used in many fields, such as piezoelectric motors, piezoelectric pumps, and high-speed intelligent valves. , warp knitting machine jacquard, weft knitting machine needle selector, etc. [0003] The existing piezoelectric ceramic actuating sheet includes a piezoelectric ceramic sheet and a supporting substrate. The piezoelectric ceramic sheet is bonded to the supporting substrate through an adhesive, but due to shrinkage during the curing of the adhesive, the gap between the piezoelectric ceramic sheet and the supporting substrate is caused. Shrinkage stress is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/187H01L41/312
CPCH10N30/853H10N30/072
Inventor 丁耀民赵程范冠锋王晓峰
Owner SUZHOU PANT PIEZOELECTRIC TECH
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