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Package structure and OLED (organic light emitting diode) device packaged by adopting same

A packaging structure, packaging cover technology

Active Publication Date: 2017-05-31
GUAN YEOLIGHT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a packaging structure and an OLED device packaged with the packaging structure. A water absorbing body and an oxygen absorbing body are added at the same time during packaging. The problem of small contact area, and this method is simple, and can significantly improve the service life of OLED devices

Method used

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  • Package structure and OLED (organic light emitting diode) device packaged by adopting same
  • Package structure and OLED (organic light emitting diode) device packaged by adopting same
  • Package structure and OLED (organic light emitting diode) device packaged by adopting same

Examples

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Embodiment 1

[0024] The present invention provides a packaging structure, including a packaging cover, the inner surface of the packaging cover has pits, the area of ​​the pits completely covers the effective light-emitting area of ​​the screen, and an OLED packaging area is arranged around the pits, such as using UV glue The screen body and the package cover are packaged, and the width of the package area is 0.5-2mm. A water absorbing body and an oxygen absorbing body are respectively arranged in the pits, the main component of the water absorbing body is a water absorbing agent, and the main component of the oxygen absorbing body is an oxygen absorbing agent. The function of the water absorbing agent is to absorb water vapor in the external environment of the OLED, and the function of the oxygen absorbing agent is to absorb oxygen in the external environment of the OLED. The oxygen absorbing agent and the water absorbing agent can be arranged in a matrix in the pit, or pasted or coated in...

Embodiment 2

[0040] The water absorbing body and oxygen absorbing body can also choose gel-like water absorbing agents and oxygen absorbing agents to achieve the encapsulation effect. The main component of the water absorbing body with the water absorbing effect is metal oxides, such as calcium oxide. The main components of the oxygen absorption effect are alkali metals and alkaline earth metals, molecular sieves or active metals. The specific setting method is as follows:

[0041] Way 2, such as figure 2 :

[0042] The water absorbing body 3 or the oxygen absorbing body 4 is dotted in the recess 2 of the packaging cover 1 in the form of glue, and the shape can be a closed shape that is sleeved at intervals (such as figure 2 Shown).

[0043] In order to achieve the encapsulation effect, the following restrictions are now made on the water absorbent and oxygen absorbent

[0044] 1. The thickness of the water absorbing body and the oxygen absorbing body is 0.05-0.5mm, this embodiment is 0.5mm;

[...

Embodiment 3

[0050] The water absorbing body 3 or the oxygen absorbing body 4 is dotted in the recess 2 of the package cover 1 in the form of glue, and each forms an independent semi-closed shape (such as image 3 Shown).

[0051] In order to achieve the encapsulation effect, the following restrictions are now made on the water absorbent and oxygen absorbent

[0052] 1. The thickness of the water absorbing body and the oxygen absorbing body is between 0.05-0.5mm, and this embodiment is 0.5mm;

[0053] 2. The total area of ​​the water absorbing body and the oxygen absorbing body accounts for more than 30% of the effective light-emitting area, the total surface area of ​​this embodiment accounts for 40% of the effective light-emitting area, and the area ratio of the water absorbing body and the oxygen absorbing body is 5:1;

[0054] 3. The water absorbing body and the oxygen absorbing body are distributed in the pits in a line manner, and are arranged at intervals, and the distance between adjacent ...

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PUM

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Abstract

The invention provides a package structure and an OLED (organic light emitting diode) device packaged by adopting the same. The package structure comprises a package cover, wherein a pit is formed in the inner surface of the package cover, and water absorption bodies and oxygen absorption bodies are arranged in the pit. The oxygen absorption bodies and the water absorption bodies are separately arranged in a matrix manner, or are attached or coated in the pit in any other patterns, and by the water absorption bodies and the oxygen absorption bodies which are separately arranged, the package structure is endowed with excellent water absorption and oxygen absorption capability, the requirement of the OLED device on water and oxygen can be met, and the service life of the device is prolonged; moreover, the method is simple in process, high in operability and suitable for large-scale mass production.

Description

Technical field [0001] The invention relates to a packaging structure and an OLED device packaged with the packaging structure. Background technique [0002] Flat panel displays have the characteristics of complete planarization, lightness, thinness, and power saving, which are the inevitable trend and research focus of the development of image displays. In various types of flat panel display devices, organic light-emitting display devices (English full name OrganicLight Emitting Display, abbreviated as OLED) use self-luminous organic light-emitting diodes (English full name as OrganicLight Emitting Diode, abbreviated as OLED) to display images, which are responsive Short time, low power consumption for driving, relatively better brightness and color purity characteristics, so organic light-emitting display devices have become the focus of next-generation display devices [0003] Since OLED is a water and oxygen sensitive device, under water and oxygen erosion, the life of the dev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/50
CPCH10K50/00H10K50/846H10K50/84
Inventor 鲁天星谢静朱映光陈旭胡永岚
Owner GUAN YEOLIGHT TECH CO LTD
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