Chip mounter work head moving mechanism and mounting method by using same
A motion mechanism and working head technology, which is applied in the direction of assembling printed circuits with electrical components, electrical components, and printed circuit manufacturing, etc., can solve the problems of complex structure, low mounting efficiency, etc. Well-designed effects
Active Publication Date: 2017-05-31
WUXI WANJI TECH CO LTD
View PDF4 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] The present invention aims to solve the technical problems of complex structure and low mounting efficiency in existing chip mounters; it provides a motion mechanism of the working head of the chip mounter and a method for mounting using it
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0014] combine figure 1 and 2 To illustrate, the moving mechanism of the working head of the placement machine of the present invention includes a head base 11 and a pre-pressing mechanism seat 9. The head base 11 is composed of an integrally formed mounting seat 111, a buffer seat 112 and a positioning seat 113. The front surface of the mounting seat 111 is provided with two mutually parallel guide rails 6 along the width direction, and two slider connecting seats matching the guide rails 6 are symmetrically arranged on the back side of the preloading mechanism seat 9, and the slider connecting seats It includes an upper slider connecting seat 91 and a lower slider connecting seat 92. The upper slider connecting seat 91 is located directly above the lower slider connecting seat 92. The upper slider connecting seat 91 is connected to the guide rail 6 through the upper slider 7. connection, the lower slider connecting seat 92 is connected to the guide rail 6 through the lower ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a chip mounter work head moving mechanism and a mounting method by using the chip mounter work head moving mechanism, and belongs to the technical field of chip mounters. The technical problem that an existing chip mounter is complicated in structure and low in mounting efficiency is to be solved. Two guide rails parallel to each other are arranged along the width direction on the front surface of a mounting base, a cylinder is arranged between the two guide rails, an electromagnetic direction valve is arranged on the cylinder, the cylinder is connected with the mounting base through a cylinder fixed base, the cylinder comprises a cylinder barrel and a piston rod, the lower end of the piston rod goes through the bottom of the cylinder barrel, the bottom of the piston rod is connected with a connecting plate, the bottom of two ends of the connecting plate is fixedly connected with a sliding block, mounting power comes from compressed gas, the cylinder can be driven by using the pressure of the gas, the control for the moving direction of the cylinder comes from the electromagnetic direction valve, the cylinder moves downwards to drive a prepressing mechanism to move downwards along the direction of the guide rails, and the prepressing mechanism drives a mounting head to move downwards so as to complete final chip mounting work. The mechanism is used for chip mounting.
Description
technical field [0001] The invention belongs to the technical field of placement machines, and in particular relates to a movement mechanism of a working head of a placement machine and a method for mounting by using the movement mechanism. Background technique [0002] Surface mount technology SMT (Surface Mount Technology) has replaced the traditional through-hole technology and dominates the development of electronic equipment. It is recognized as a revolutionary change in electronic assembly technology. SMT aims to improve product reliability and performance and reduce costs. Whether it is in consumer electronic products or in the field of military cutting-edge electronic products, it will bring about major changes in electronic products. The placement head is one of the most critical equipment of the placement machine, which directly affects the speed and accuracy of the placement head. [0003] At present, in the placement process of the chip head, the positioning is ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H05K13/04H05K3/30
CPCH05K3/303H05K13/046
Inventor 华杰雷怀
Owner WUXI WANJI TECH CO LTD