Novel sensor

Abstract

The invention relates to a novel sensor comprising an excitation power supply, three pressure sensor bodies, a thermal resistor and three pressure sensor data meters. Each pressure sensor body includes an outer packaging housing and a group in the packaging housing and including a core body, a core base, and an integrated circuit board. The outer packaging housing comprises a substrate and a cover housing. The substrate is provided with a positioning recess and a circuit board fixing groove. A cushioning pad is arranged in the positioning recess. The height of the cushioning pad is less than the depth of the positioning recess. The top of the core body is aligned with the plane of the substrate. A clamping groove is disposed on the center of the cushioning pad. The core body comprises a silicon piezoresistive sensing element provided with a bridge therein and successively covered with a silicon oxide layer and a silicon nitride layer from outside to inside. The core body is arranged in the core base and the integrated circuit board is fixedly disposed in the circuit board fixing groove. The novel sensor is good in reliability, low in cost, high in measurement precision, high in sensitivity, wide in measuring range, uneasy to damage, long in service life and good in applicability.

Description

technical field [0001] The invention relates to a sensor, in particular to a novel sensor, especially a novel pressure sensor. Background technique [0002] In the 1980s, the traditional pressure sensor used thick-film ceramic technology. After years of development, although the production cost of the ceramic core has been greatly reduced, due to the extremely brittle characteristics of the ceramic material, it cannot resist liquid pressure shock overload and anti-vibration. Poor capability, low sensitivity output, poor reliability, and thus eliminated. In the 1990s, a new pressure sensor appeared. It still maintains the low-cost characteristics in terms of the production cost of the core body. It solves the problem of poor anti-vibration ability of thick-film ceramics, and at the same time improves a certain resistance to pressure shock overload. ability, but because of its structural principle using the adhesive metal strain gauge technology, the fatigue of the organic gl...

AI Technical Summary

Problems solved by technology

[0002] In the 1980s, the traditional pressure sensor used thick-film ceramic technology. After years of development, although the production cost of the ceramic core has been greatly reduced, due to the extremely brittle characteristics of the ceramic material, it cannot resist liquid pressure shock overload and anti-vibration. Poor capability, low sensitivity output, poor reliability, and thus eliminated

In the 1990s, a new pressure sensor appeared. It still maintains the low-cost characteristics in terms of the production cost of the core body. It solves the problem of poor anti-vibration ability of thick-film ceramics, and at the same time improves a certain resistance to pressure shock overload. ability, but because of its structural principle using the glued metal strain gauge technology, the fatigue of the organic glue leads to a short overall life of the sensor, and the measurement accuracy will decrease with the use time due to the creep of the glue, while the sensitivity output is still very low

[0003] In recent years, this technology has been improved, and the high-temperature glass powder sintered silicon strain gauge technology has been used to replace the adhesive metal strain gauge technology. Although the core production cost has risen slightly, it has solved the problem of sensor life and measurement accuracy over time. At the same time, the use of silicon strain gauges greatly improves the sensitivity output. However, because the glass powder layer in the sintered glass powder process is very thin, the area is relatively large. The phenomenon of fracture of the sintered glass layer occurs,

[0004] In addition, the existing pressure sensor, when its sensitivity is high, the measurement accuracy is poor, which has always been a contradiction that is difficult to resolve in this field.

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