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Mobile phone camera laser welding method

A mobile phone camera and laser welding technology, applied in welding/welding/cutting items, manufacturing tools, metal processing, etc., can solve problems affecting product quality, low yield, black plastic burns, etc., to improve welding efficiency and finished products efficiency and improve product quality

Inactive Publication Date: 2017-06-09
WUHAN LOTUXS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Soldering iron robot or manual soldering iron has low welding efficiency and low yield, and the soldering iron robot or manual soldering iron uses contact welding, which will burn the black plastic around the solder joint and affect product quality

Method used

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  • Mobile phone camera laser welding method
  • Mobile phone camera laser welding method
  • Mobile phone camera laser welding method

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Embodiment Construction

[0025] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0026] refer to Figure 1 to Figure 5 Shown, the mobile phone camera laser welding method in an embodiment provided by the invention comprises the following steps:

[0027] 1) Place the solder on the pins of the mobile phone camera and the pads to be soldered;

[0028] 2) Use a laser to irradiate the laser light onto the metal on the back of the welding point of the mobile phone camera for heating;

[0029] 3) The metal on the back of the soldering point makes the solder reach the melting point of the solder and become a molten liquid through heat conduction;

[0030] 4) The liquid solder transfers temperature to the pins and pads of the mobile phone camera;

[0031] 5) When the temperature of the pins and pads reaches a specific temperature, the liquid solder physically reacts with the pins and pads to form an alloy layer at the soldering point; ...

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PUM

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Abstract

The invention discloses a mobile phone camera laser welding method. The mobile phone camera laser welding method comprises the following steps that welding materials are placed at to-be-welded points of a pin and a welding disc of a mobile phone camera; lasers irradiate metal on the back faces of the welding point positions of the mobile phone camera through a laser device for heating; the welding materials reach the welding material melting point to become a molten liquid state through the metal on the back faces of the welding point positions in a heat conduction manner; the liquid welding materials transmit temperature to the pin and the welding disc of the mobile phone camera; after the temperature of the pin and the temperature of the welding disc reach specific temperature, the liquid welding materials, the pin and the welding disc generate a physical reaction, and alloy layers are formed at the welding point positions; and welding of the next welding point is carried out, and the above steps are repeated till all the welding points are welded. PCB substrates and plastic around the welding points can be prevented from being burnt during direct welding, the product quality is improved, and the welding efficiency and the rate of finished products are increased.

Description

technical field [0001] The invention relates to the technical field of mobile phone camera welding, in particular to a laser welding method for a mobile phone camera. Background technique [0002] The existing mobile phone camera welding adopts a soldering iron robot or a manual soldering iron method, and solders the solder joints by feeding tin wire. Soldering iron robot or manual soldering iron has low welding efficiency and low yield, and the soldering iron robot or manual soldering iron uses contact welding, which will burn the black plastic around the solder joints and affect product quality. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a laser welding method for mobile phone camera for the above-mentioned defects in the prior art, which can avoid burning the PCB substrate and plastic around the welding spot during direct welding, improve product quality, and improve welding efficiency and yield. [000...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/005B23K101/36
CPCB23K1/0016B23K1/0056B23K2101/36
Inventor 杨林詹学武
Owner WUHAN LOTUXS TECH