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A device and a detection method for online detection of the service life of a polishing pad

A detection method and technology for grinding pads, which are used in grinding devices, measuring devices, grinding machine tools, etc., can solve the problems of increasing production costs, insufficient use of grinding pads, and inability to detect wear conditions of grinding pads in real time.

Active Publication Date: 2019-04-23
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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Problems solved by technology

[0009] Therefore, the current polishing pad monitoring method is a subjective and indirect monitoring method. When the polishing process is performed on the same polishing pad for different wafers, it cannot detect the wear of the polishing pad in real time, resulting in insufficient polishing of the polishing pad. use, thereby increasing production costs

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  • A device and a detection method for online detection of the service life of a polishing pad
  • A device and a detection method for online detection of the service life of a polishing pad
  • A device and a detection method for online detection of the service life of a polishing pad

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Embodiment Construction

[0034] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0035] It should be noted that, in the following specific embodiments, when describing the embodiments of the present invention in detail, in order to clearly show the structure of the present invention for the convenience of description, the structures in the drawings are not drawn according to the general scale, and are drawn Partial magnification, deformation and simplification are included, therefore, it should be avoided to be interpreted as a limitation of the present invention.

[0036] In the following specific embodiments of the present invention, please refer to figure 1 , figure 1 It is a schematic diagram of the usage state of a device for online detection of the usage cycle of the polishing pad in a preferred embodiment of the present invention. Such as figure 1 As shown, a device for online detection of the service ...

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Abstract

The invention discloses a device of detecting the service period of a grinding pad online and a detection method. The service life of the grinding pad is specifically quantified by means of difference of transmission rates in different media. The thickness of the grinding pad is measured by way of ultrasonic detection, and thickness accurate data of the current grinding pad can be obtained, so that the grinding condition of the grinding pad can be detected in real time, and the grinding pad is fully utilized. The device disclosed by the invention has the advantage of objectively and directly confirming the service life of the grinding pad.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit equipment, and more specifically, to a device and a detection method capable of online detection of the service life of a polishing pad. Background technique [0002] In wafer manufacturing, with the upgrading of process technology and the reduction of wire and gate size, lithography technology has higher and higher requirements for the flatness of wafer surface (Non-uniformity), which makes chemical mechanical polishing (Chemical Mechanical Polishing, referred to as CMP) technology has been widely used. [0003] Since the grinding rate, the friction coefficient of the grinding pad and the grinding time show the same trend of change, they all decrease sharply with the increase of the grinding time, so it is very necessary to monitor the loss of the grinding pad in a timely and effective manner. [0004] Under the existing technical conditions, the service life of the abra...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/005B24B49/00G01B17/02
CPCB24B37/005B24B49/003G01B17/02
Inventor 戴文俊
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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