A pressure welding system

A welding head and workpiece technology, applied in the field of welding equipment, can solve the problems of increased production cost, high scrap rate of workpieces, waste of production materials, etc., and achieves the effects of reducing maintenance costs, preventing damage, and reducing impact force.

Active Publication Date: 2019-02-12
ZHEJIANG IND POLYTECHNIC COLLEGE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the process of use, it was found that since the pressure welding uses the welding head for stamping welding, and the thickness of the circuit board is small, it is easy to deform and break when the welding point is under pressure, resulting in damage to the circuit board and the scrap rate of the workpiece is too high. High, which greatly increases the production cost and causes waste of production materials

Method used

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0029] Such as Figure 1-13 As shown, a pressure welding system includes a cleaning unit 1 for removing impurities on the surface of workpieces to be processed and a pressure welding unit 2 for performing pressure welding operations on workpieces. The pressure welding unit 2 includes a frame 21, a device The workbench 22, the pressure welding power arm 23, the pressure welding assembly, the heating structure and the first driver 25 on the frame; the pressure welding power arm 23 can move up and down along the frame, and the first driver 25 is Rodless cylinder; in order to prevent the pressure welding power arm 23 from shifting in the process of moving up and down, we set two ...

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Abstract

The invention discloses a novel pressure welding system. The novel pressure welding system comprises a cleaning unit for cleaning impurities on surfaces of to-be-machined workpieces and a pressure welding unit for performing pressure welding operation on the workpieces, wherein the pressure welding unit comprises a rack, a workbench arranged on the rack, a pressure welding power arm capable of acting along the rack up and down, a pressure welding assembly connected with the pressure welding power arm, a heating structure for heating the pressure welding assembly as well as a first drive part for driving the pressure welding power arm to act up and down; the pressure welding assembly comprises a pressure welding head and a pressure dispersion part connected to the pressure welding power arm through an elastic part, and in the initial state, the pressure dispersion part is located below a pressure welding head and above the workbench. The novel pressure welding system can effectively disperse pressure applied by the pressure welding head to the workpieces, prevent workpiece deformation or damage caused by over-high pressure on to-be-welded positions and reduce the scrap rate of the workpieces; the pressure welding position is accurate and the welding quality and efficiency are improved.

Description

technical field [0001] The invention belongs to the technical field of welding equipment, and in particular relates to a pressure welding system. Background technique [0002] In the existing production process of circuit boards, when soldering pads and leads in the circuit boards, manual soldering is usually used, and the soldering efficiency is low and the soldering effect is not satisfactory. In order to ensure the accurate and firm welding of the two, various types of welding equipment have appeared in the prior art to weld the pads and leads in the circuit board. The effect and efficiency of welding have been significantly improved, and the pressure welding effect is the best. , The welding speed is fast and the welding position is accurate. However, in the process of use, it was found that since the pressure welding uses the welding head for stamping welding, and the thickness of the circuit board is small, it is easy to deform and break when the welding point is unde...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K11/30
CPCB23K11/3009
Inventor 赵巧良范里洪
Owner ZHEJIANG IND POLYTECHNIC COLLEGE
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