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Array hole machining device

A processing device and a technology of array holes, which are applied in the field of laser applications, can solve problems such as uneven distribution of beam energy, and achieve the effects of improving processing quality, uniform distribution of beam energy, and uniform energy distribution

Pending Publication Date: 2017-06-13
GUANGDONG UNIV OF TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing laser beam splitter light splitting method still has the following defects: the output laser beam exhibits Gaussian characteristics, the energy distribution of the beam is uneven, grooves or concave holes will be generated at the processing position of the substrate, and the processed microholes show certain taper and therefore cannot meet the requirements

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Embodiment Construction

[0030] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0031] Please refer to figure 1 , an array hole processing device provided by an embodiment of the present invention includes:

[0032] A laser generating device 10 for generating laser and realizing beam expansion and collimation;

[0033] A beam selector 11 for gating the central area of ​​the beam and intercepting the edge area of ...

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Abstract

The invention discloses an array hole machining device which comprises a laser generation device, a light beam selector, a light beam shaper, a beam splitting component and a focusing component. The laser generation device, the light beam selector, the light beam shaper, the beam splitting component and the focusing component are sequentially arranged in the light path direction, the laser generation device is used for generating laser and achieving light beam expansion and alignment, the light beam selector is used for grating a light beam central region and intercepting a light beam edge region, the light beam shape is used for adjusting energy of light beams emitted from the light beam selector to be uniformly distributed, the beam splitting component is used for splitting the light beams output by the light beam shaper into array light beams broadcast in parallel, the beam splitting component is provided with a plurality of micro-optical structures arranged in an array mode, and the focusing component is used for gathering the array light beams to the same plane to form array laser beams applied to machining. According to the array hole machining device, the portion, with the high energy, of the light beam central region is gated at first before laser beam splitting, light beams are shaped so that energy of the light beams is uniformly distributed, the energy of the laser beams for machining is uniformly distributed, tape generated by micropores can be decreased during machining, and the micropore machining quality can be improved.

Description

technical field [0001] The invention relates to the field of laser application technology, in particular to an array hole processing device. Background technique [0002] At present, laser processing technology is applied to the microhole processing of three-dimensional packaging chips. Packaging chips need to process a large number of microholes, and the quality of the microholes is high, the hole depth is large, and the drilling time is relatively long, while chip packaging requires high-speed and high-precision processing. , so in order to improve the efficiency of laser microhole processing, parallel processing will be adopted, and the output laser beam is required to have high power and good beam quality. [0003] Generally, an array of beams is obtained by splitting laser beams to realize parallel processing. In the prior art, methods for splitting laser beams include beam splitting by laser beam splitters, laser diffraction splitting, and beam splitting prisms. Among...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/09G02B27/10G02B27/12B23K26/382
CPCG02B27/0927G02B27/106G02B27/1086G02B27/123B23K26/382
Inventor 高健陈伟帆陈新陈云贺云波杨海东
Owner GUANGDONG UNIV OF TECH
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