Array hole machining device

Abstract

The invention discloses an array hole machining device which comprises a laser generation device, a light beam selector, a light beam shaper, a beam splitting component and a focusing component. The laser generation device, the light beam selector, the light beam shaper, the beam splitting component and the focusing component are sequentially arranged in the light path direction, the laser generation device is used for generating laser and achieving light beam expansion and alignment, the light beam selector is used for grating a light beam central region and intercepting a light beam edge region, the light beam shape is used for adjusting energy of light beams emitted from the light beam selector to be uniformly distributed, the beam splitting component is used for splitting the light beams output by the light beam shaper into array light beams broadcast in parallel, the beam splitting component is provided with a plurality of micro-optical structures arranged in an array mode, and the focusing component is used for gathering the array light beams to the same plane to form array laser beams applied to machining. According to the array hole machining device, the portion, with the high energy, of the light beam central region is gated at first before laser beam splitting, light beams are shaped so that energy of the light beams is uniformly distributed, the energy of the laser beams for machining is uniformly distributed, tape generated by micropores can be decreased during machining, and the micropore machining quality can be improved.

Description

technical field [0001] The invention relates to the field of laser application technology, in particular to an array hole processing device. Background technique [0002] At present, laser processing technology is applied to the microhole processing of three-dimensional packaging chips. Packaging chips need to process a large number of microholes, and the quality of the microholes is high, the hole depth is large, and the drilling time is relatively long, while chip packaging requires high-speed and high-precision processing. , so in order to improve the efficiency of laser microhole processing, parallel processing will be adopted, and the output laser beam is required to have high power and good beam quality. [0003] Generally, an array of beams is obtained by splitting laser beams to realize parallel processing. In the prior art, methods for splitting laser beams include beam splitting by laser beam splitters, laser diffraction splitting, and beam splitting prisms. Among...

AI Technical Summary

Problems solved by technology

However, the existing laser beam splitter light splitting method still has the following defects: the output laser beam exhibits Gaussian characteristics, the energy distribution of the beam is uneven, grooves or concave holes will be generated at the processing position of the substrate, and the processed microholes show certain taper and therefore cannot meet the requirements

Images