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Circuit board structure with embedded device and manufacturing method of circuit board structure

A manufacturing method and circuit board technology, which are applied in the directions of printed circuits, circuits, printed circuits, etc., where non-printed electrical components are connected, can solve the problems of filling holes and copper plating that cannot be completely filled, product bubble reliability, etc.

Inactive Publication Date: 2017-06-13
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are different laser hole heights in the existing process, the laser hole of the thin chip pad is deep, and the copper plating in the hole cannot be completely filled, resulting in air bubbles (reliability) problems in the final product

Method used

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  • Circuit board structure with embedded device and manufacturing method of circuit board structure
  • Circuit board structure with embedded device and manufacturing method of circuit board structure
  • Circuit board structure with embedded device and manufacturing method of circuit board structure

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Experimental program
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Embodiment Construction

[0029] Embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention.

[0030] See Image 6 , which is an embodiment of the present application provides a circuit board structure with embedded devices, which includes a carrier board 10, an insulating layer 12 formed on two opposite surfaces of the carrier board 10, a circuit layer 14 covering the two insulating layers 12, a second An electrical device 20 and a second electrical device 30 . The carrier board 10 is a circuit board formed with circuits or a metal conductor of the circuit board. In this embodiment, the carrier board 10 is a supporting frame made of copper and simultaneously realizes metal conduction.

[0031] The carrier 10 includes a first surface 101 and a second surface 102 opposite to the first surface 101 . The receiving groove 11 is recessed on the first surface 101 . The first electrical device 20 is accommodated in the accommodat...

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PUM

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Abstract

The invention discloses a circuit board structure with an embedded device. The circuit board structure comprises a carrier plate, a first electric device, a second electric device, insulation layers and circuit layers, wherein an accommodating groove is concavely arranged in one surface of the carrier plate, the first electric device is accommodated in the accommodating groove, the second electric device is fit to the surface of the carrier plate, a depth of the accommodating groove is a thickness difference of the first electric device and the second electric device, and the thickness of the first electric device is greater than the thickness of the second electric device; the insulation layers are formed on two opposite surfaces of the carrier plate and cover the first electric device and the second electric device; and the circuit layers cover the two insulation layers, and one circuit layer comprises a conductive body penetrating through the insulation layers to connect with the first electric device and the second electric device.

Description

technical field [0001] The invention relates to the technical field of signal card connection, in particular to a circuit board structure with embedded devices and a manufacturing method thereof. Background technique [0002] In order to meet the market demand, the chip package structure strives to be light, thin and short, and the chip is also developing towards small size and high integration (Integration). In view of this, the circuit board as the chip carrier is preferably equipped with high-density electrical connection pads. So that the chip carried on the circuit board can form a good and complete electrical connection with the circuit board, so that the highly integrated semiconductor chip can operate freely and fully exert its functions and characteristics. [0003] At present, the general method of embedded circuit board carrier board in the industry is to dig out a cavity on the carrier board, mount the chip in the cavity, and then use resin to seal the chip on bo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18
CPCH01L2224/04105H01L2224/32245H01L2224/73267H01L2924/15153H05K1/183H05K2201/09036
Inventor 廖小景侯召政王军鹤
Owner HUAWEI TECH CO LTD