Preparation of heat-conducting joint-filling material

A technique of caulking material and aluminate coupling agent, which is applied in the field of synthetic chemistry to achieve the effects of wide application, simple synthesis reaction process and low production cost

Inactive Publication Date: 2017-06-16
烟台鑫海耐磨胶业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, for electronic manufacturers, this kind of product will cause a lot of inconvenience to use, so it is abandoned

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Accurately weigh 100 parts of the resin matrix, add 25 parts of aluminate coupling agent, add it into the mixing mixer, and stir for 40 minutes at a vacuum of -0.1MPa. After the stirring is completed, add 100 parts to the above mixture part of aluminum hydroxide, stirred for 5 minutes under a vacuum of -0.1MPa, and then 150 parts of thermally conductive filler boron nitride, stirred for 30 minutes under a vacuum of -0.1MPa, and then discharged, and the mixture was formed into a 5mm After the sheet is cured at 130°C for 20 minutes, the thermally conductive gap material is obtained.

Embodiment 2

[0010] Accurately weigh 120 parts of the resin matrix, add 30 parts of aluminate coupling agent, add it into the mixing mixer, and stir for 50 minutes at a vacuum of -0.1MPa. After the stirring is completed, add 100 parts to the above mixture part of aluminum hydroxide, stirred for 10 minutes under a vacuum of -0.1MPa, and then 150 parts of thermally conductive filler boron nitride, stirred for 30 minutes under a vacuum of -0.1MPa, and then discharged, and the mixture was shaped into a 5mm After the sheet is cured at 130°C for 30 minutes, the thermally conductive gap material is obtained.

Embodiment 3

[0012] Accurately weigh 110 parts of the resin matrix, add 28 parts of aluminate coupling agent, add it into the mixing mixer, and stir for 45 minutes at a vacuum of -0.1MPa. After the stirring is completed, add 100 part of aluminum hydroxide, stirred for 8 minutes under a vacuum of -0.1MPa, and then 150 parts of thermally conductive filler boron nitride, stirred for 30 minutes under a vacuum of -0.1MPa, and then discharged, and the mixture was formed into a 5mm After the sheet is cured at 130°C for 25 minutes, the thermally conductive gap material is obtained.

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PUM

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Abstract

The invention relates to preparation of a heat-conducting joint-filling material. The preparation comprises the following steps: accurately weighing 100 to 120 parts of a resin matrix, adding 25 to 30 parts of an aluminate coupling agent; adding the above substances into a mixer and carrying out stirring at a vacuum degree of -0.1 MPa for 40 to 50 min; after completion of stirring, adding 100 parts of aluminum hydroxide into a mixture obtained in the previous step and carrying out stirring at a vacuum degree of -0.1 MPa for 5 to 10 min; then adding 150 parts of the heat-conducting filler boron nitride, carrying out stirring at a vacuum degree of -0.1 MPa for 30 min and then carrying out blanking; and molding a mixture obtained in the previous step into a sheet material with a size of 5 mm and subjecting the sheet material to curing at 130 DEG C for 20 to 30 min so as to obtain the heat-conducting joint-filling material.

Description

technical field [0001] The invention relates to the preparation of a heat-conducting gap-filling material, which belongs to the field of synthetic chemistry. Background technique [0002] The assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature. According to the data, the reliability of electronic components decreases by 10% for every 2°C increase in temperature, and the service life at 50°C is only 1 / 6 of that at 25°C. The improvement of thermal conductivity is usually accompanied by the optimization of heat dissipation performance. Therefore, thermal gap interface materials have attracted more and more attention. It has high thermal conductivity, good elasticity, electrical insulation, and sealing, and can effectively fill the gap between the interfaces, remove the air between the hot and cold interfaces, and increase the efficiency of the radiator by more than 40%. [0003] At present, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08K5/10C08K3/22C08K3/38C09K5/14
Inventor 阎珊珊
Owner 烟台鑫海耐磨胶业有限公司
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