Planning method for CCOS polishing process full-band convergence path
A path planning and path technology, used in grinding/polishing equipment, manufacturing tools, geometric CAD, etc., can solve the problems of decreased processing quality, impacted processing accuracy, sudden change in rate, etc., to overcome errors in removal, improve randomness, and improve The effect of polishing precision
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[0031] The CCOS polishing process of this embodiment is carried out on a polishing equipment based on an ABB manipulator. The process parameters are set as follows: the diameter of the small grinding head is 20mm, the applied pressure is 10N, the revolution speed is 120rpm, the rotation speed is 200rpm, and the polishing liquid composition is CeO 2 , the concentration is 10% w.t, the ambient temperature is 23°C, and the test workpieces to be polished are two pieces of BK7 optical glass of 70mm×70mm. In the experiment, the two workpieces were processed with grid path and new path respectively, and the processing results were compared.
[0032] The workpiece is polished by the following methods:
[0033] 1. Determine the removal function: Apply the above process to carry out the removal function experiment, so as to obtain the removal function, the removal function is as follows figure 2 As shown, the removal function diameter is 30mm;
[0034] 2. Detection of surface shape e...
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