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LED packaging manufacturing process

A technology of LED packaging and manufacturing process, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low yield rate, uneven light output, waste of phosphor powder, etc., and achieve the effect of ensuring quality and improving optical performance

Inactive Publication Date: 2017-06-20
DONGGUAN SINOWIN OPTO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large volume of the packaging colloid, if the colloid mixed with phosphor is used for encapsulation, it will easily lead to waste of phosphor and uneven distribution of phosphor, prone to uneven light output, etc., leading to low yield

Method used

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  • LED packaging manufacturing process
  • LED packaging manufacturing process
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Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the following will describe the present invention more fully. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0028] see Figure 1 to Figure 4 , is the LED encapsulation manufacturing process of a preferred embodiment of the present invention, comprises the following steps:

[0029] Step 1, providing a cerami...

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Abstract

The invention discloses an LED packaging manufacturing process, which comprises the following steps: 1, a ceramic substrate is provided; 2, a plurality of chips are provided and are uniformly arranged on the ceramic substrate at intervals; 3, a prefabricated fluorescent diaphragm is provided to cover the chip; and 4, LED packaging particles are cut. According to the LED packaging manufacturing process of the invention, in a mode of covering the chip by the fluorescent diaphragm, fluorescent powder mixed processing on the whole packaging body is avoided, the quality of the fluorescent diaphragm can be ensured effectively as the fluorescent diaphragm is manufactured independently, and the optical performance of the LED packaging structure is improved.

Description

technical field [0001] The invention relates to a semiconductor package structure, in particular to a manufacturing process of an LED package. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, energy saving and environmental protection, and high luminous efficiency. As a new type of light source, it has been widely used more and more In the fields of indication, display, decoration, backlight, general lighting and urban night scene. [0003] In the existing packaging structure of light-emitting LEDs, the packaging colloid and phosphor powder are usually mixed, and then the chips and wires are packaged. However, due to the large volume of the encapsulating colloid, if the colloid mixed with phosphor is used for encapsulation, it will easily lead to waste of phosphor and uneven distribution of phosphor, prone to uneven light output, etc., leading to a low yi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/52H01L33/58
CPCH01L33/52H01L33/005H01L33/58
Inventor 尹梓伟张万功
Owner DONGGUAN SINOWIN OPTO ELECTRONICS