Radiatorfor server case

Abstract

The invention discloses a radiatorfor a server case. The radiator includes a server case body and a radiating device, the server case body includes a case-body shell, a radiating window, a base, fixed support legs, a placement bracket andfixed buckles, the radiating window is fixed on the right side of the case-body shell, the inner side of the radiating window is provided with a ventilation net, the upper and lower sides of the radiating window are provided with the fixed buckles, the left side of the case-body shell is provided with a fixed clamping plate, the radiating device includes connection plates, an electric rotation shaft, radiating fan blades, heat-conducting copper pipes, a radiating sheet and a radiating-sheet base, two sides of the electric rotation shaft are welded with the radiating fan blades, the connection plates are arranged on the right of the radiating fan blades, the right sides of the connection plates are fixedly connected with the radiating-sheet base, the right side of the radiating-sheet base is fixedly connected with the radiating sheet, and the upper and lower sides of the radiating sheet are welded with the heat-conducting copper pipes. The radiatorfor the server case has the advantages of being convenient to use, good in radiating effect, convenient to maintain and the like, and the radiatorfor the server case can be widely popularized and utilized.

Description

technical field [0001] The invention belongs to the technical field of computer equipment components, and in particular relates to a radiator for a server case. Background technique [0002] With the improvement of computer computing and processing capabilities, the heat generated by chips is also increasing at an alarming rate. In large-scale open ventilation equipment, heat sinks and air cooling are mainly used for heat dissipation. However, for some standard chassis, the board space and air ducts are limited. In order to ensure the good work of the main board, in addition to requiring the board In addition to having a reasonable device layout and using a suitable fan, there are also high requirements for the heat sink of the board card. [0003] At present, most servers often fail to work normally due to the heat generated by the internal electronic components, reduce work efficiency, or even stop working or cause spontaneous combustion. The heat dissipation of the serve...

AI Technical Summary

Problems solved by technology

[0003] At present, most servers often fail to work normally due to the heat generated by the internal electronic components, reduce work efficiency, or even stop working or cause spontaneous combustion. The heat dissipation of the server chassis is usually air-cooled through the internal cooling fan. This heat dissipation method is relatively backward. Although it is more economical and convenient, the heat dissipation effect is poor, and the heat dissipation rate is easily affected by dust, room temperature and other factors.

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