Radiatorfor server case

A server and heat sink technology, which is applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of reduced work efficiency, failure to work normally, and backward heat dissipation methods, so as to prolong the service life and avoid dust on the ground Effect of intrusion and reduction of static electricity

Inactive Publication Date: 2017-06-23
蒋宗霞
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  • Abstract
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Problems solved by technology

[0003] At present, most servers often fail to work normally due to the heat generated by the internal electronic components, reduce work efficiency, or even stop working or cause spontaneous combustion. The heat dissipation of the server chassis is usually air-cooled through the internal cooling fan. This heat dissipation method is relatively backward. Although it is more economical and convenient, the heat dissipation effect is poor, and the heat dissipation rate is easily affected by dust, room temperature and other factors.

Method used

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  • Radiatorfor server case
  • Radiatorfor server case

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Embodiment Construction

[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0015] see figure 1 , figure 1 It is a structural schematic diagram of the heat sink for the server case of the present invention. It includes a server box 1 and a heat dissipation device 2. The server box 1 includes a box shell 101, a heat dissipation window 102, a base 103, a fixed leg 104, a placement bracket 105, and a fixing buckle 106. The box shell 101 is right The heat dissipation window 102 is fixed on the side, and the heat dissipation window 102 i...

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Abstract

The invention discloses a radiator for a server case, comprising a server case body and a heat dissipation device. The server case body comprises a case body shell, a heat dissipation window, a base, a fixing leg, a placing bracket and a fixing buckle. The case body A heat dissipation window is fixed on the right side of the housing, a ventilation net is arranged on the inner side of the heat dissipation window, fixed clips are provided on the upper and lower sides of the heat dissipation window, and a fixed clip plate is provided on the left side of the box shell, and the heat dissipation device includes a connection plate, electric rotating shaft, cooling fan blade, heat-conducting copper tube, heat sink, heat sink base, both sides of the electric rotating shaft are welded with the cooling fan blade, the right side of the cooling fan blade is provided with a connecting plate, and the right side of the connecting plate is It is fixedly connected with the heat sink base, the right side of the heat sink base is fixedly connected with the heat sink, and the upper and lower sides of the heat sink are welded with the heat-conducting copper tube. The radiator for the server case has the advantages of convenient use, good heat dissipation effect, convenient maintenance and the like, and can be widely used.

Description

technical field [0001] The invention belongs to the technical field of computer equipment components, and in particular relates to a radiator for a server case. Background technique [0002] With the improvement of computer computing and processing capabilities, the heat generated by chips is also increasing at an alarming rate. In large-scale open ventilation equipment, heat sinks and air cooling are mainly used for heat dissipation. However, for some standard chassis, the board space and air ducts are limited. In order to ensure the good work of the main board, in addition to requiring the board In addition to having a reasonable device layout and using a suitable fan, there are also high requirements for the heat sink of the board card. [0003] At present, most servers often fail to work normally due to the heat generated by the internal electronic components, reduce work efficiency, or even stop working or cause spontaneous combustion. The heat dissipation of the serve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/181G06F1/20
Inventor 蒋宗霞
Owner 蒋宗霞
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