Turntable-type wafer automatic dividing loader

Abstract

The invention discloses a turntable-type wafer automatic dividing loader, which comprises a host platform, a feeding table, a driving mechanism, a transmission rod, a dividing carrier, a sliding vane slope, a carrier lifting mechanism, a wafer carrier and a wafer carrier storage water tank, wherein the host platform is provided with a wafer dropping hole; the dividing carrier is arranged on the host platform and is connected with the driving mechanism through the transmission rod; the dividing carrier is provided with round holes for accommodating wafers; the feeding table is located at one side, close to the edge, above the host platform; the driving mechanism is located above the middle part of the host platform; the upper end of the sliding vane slope is located below the wafer dropping hole in the host platform, and the lower end is aligned with the clamping groove of the wafer carrier; and the wafer carrier is placed inside the wafer carrier storage water tank and lifting is controlled by the carrier lifting mechanism. The structure is delicate and simple, automatic division of laminated wafers can be realized, the wafer can be automatically loaded to the carrier clamping groove, the working intensity of an operator is greatly reduced, the working efficiency is improved, and the risk of wafer loss caused by manual errors can be reduced.

Description

technical field [0001] The invention relates to a turntable type wafer automatic slice loading machine, which is suitable for the process of loading the wafer slices into wafer carriers after cutting and grinding 4-8 inch wafers, and belongs to the technical field of semiconductor material wafer manufacturing equipment. Background technique [0002] In the process of semiconductor wafer processing and manufacturing, some processing procedures, such as single crystal wire cutting and wafer grinding, need to separate stacked wafers one by one, load them into wafer carriers, and transfer them to other processes. In the factory, the separation and the work of the wafer loader are usually done manually by the operator. The manual operation is inefficient, and it is easy to cause the wafer to be placed in the wrong slot. Such manual operation can easily cause wafer breakage and product loss. Contents of the invention [0003] The purpose of the present invention is to provide a...

AI Technical Summary

Problems solved by technology

In the factory, the separation is usually done manually by the operator, the work of the wafer loader, the manual operation is inefficient, and it is easy to cause the wafer to be placed in the wrong slot, etc.

Such manual operation can easily cause wafer breakage and product loss

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