Electronic package having electromagnetic interference shielding and associated method
A technology of electronic packaging and electrical conductors, applied in the fields of magnetic field/electric field shielding, electric solid devices, circuits, etc., can solve problems such as increasing manufacturing complexity and increasing cost
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[0019] Various embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments are shown. Many different forms may be embodied and the described embodiments should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope to those skilled in the art.
[0020] exist figure 1 An example electronic package is shown generally at 10 in . As illustrated, electronic package 10 is formed as a ball grid array electronic package. Other package designs can be used, including land grid array, dual in-line package (DIP), quad flat pack (QFP), or flip chip. Electronic package 10 includes a dielectric substrate 12 having a first surface 12a and a second surface 12b and includes one or more conductive layers, vias, or coated vias for interconnection, as is well known in the art. A metalliza...
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