High-precision film cutting device for film production

A high-precision, membrane device technology, applied in metal processing and other directions, can solve problems such as deformation and rapid rise, and achieve the effect of convenient operation, reasonable structure, and prevention of deformation of the film

Active Publication Date: 2017-07-14
浙江班萘特复合材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the present invention provides a high-precision film cutting device for film production. When the film is reciprocated up and down by the cutting mechanism, the buffer mechanism is driven by the cutting mechanism to press down the film to form a section. The buffer section, and when the cutting mechanism cuts the film, the buffer mechanism will rise rapidly with the lowering of the cutting mechanism, without the need for the film to bear its weight, and at the same time, the edge-holding mechanism will press the two sides of the film to fix it , so that the cutting mechanism can accurately and quickly cut the film, which solves the technical problem of the film being deformed by punching pressure and tension during the cutting process, and realizes the function of film buffering and automatic positioning of cutting

Method used

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  • High-precision film cutting device for film production
  • High-precision film cutting device for film production
  • High-precision film cutting device for film production

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Embodiment 1

[0059] Such as figure 1 Shown is a high-precision film cutting device for film production, including a frame 1, and also includes:

[0060] Film cutting mechanism 2, said film cutting mechanism 2 is arranged on the middle part of frame 1, and it is used for cutting film;

[0061] Buffer mechanism 3, the buffer mechanism 3 is fixedly arranged on the frame 1, it is symmetrically arranged on both sides of the described film cutting mechanism 2, and it is connected with the upper end of the film cutting mechanism 2, the buffer mechanism 3 includes buffer Component 31 and connecting component 32;

[0062] A crimping mechanism 4, the crimping mechanism 4 is symmetrically arranged between the buffer mechanism 3 and the film cutting mechanism 2, and its rotation is arranged at the front and rear edges of the frame 1, and the crimping mechanism 4 is used for film The two sides of the crimping mechanism 4 include a crimping assembly 41 and a toggle assembly 42;

[0063] Conveying mec...

Embodiment 2

[0111] Figure 7 It is a structural schematic diagram of Embodiment 2 of a high-precision film cutting device for film production of the present invention; as Figure 6 As shown, the parts that are the same as or corresponding to those in Embodiment 1 use the reference numerals corresponding to Embodiment 1. For the sake of simplicity, only the differences from Embodiment 1 will be described below. This embodiment two and figure 1 The difference of the shown embodiment one is:

[0112] Such as Figure 7 As shown, a high-precision film cutting device for film production, the bottom of the chute 3111 is provided with a buffer spring 314 , and the buffer spring 314 is located below the buffer seat 312 .

[0113] It should be noted that the buffer assembly 31 presses down the film by its own gravity, so that the film forms a buffer section, so as to avoid damage to the film due to its own gravity when the buffer assembly 31 is pressed down. A buffer spring 314 is arranged at t...

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PUM

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Abstract

The invention discloses a high-precision film cutting device for film production. The device comprises a cutting mechanism, a buffer mechanism and an edge pressing mechanism; when the cutting mechanism is used for cutting films in an up-down reciprocating manner, the cutting mechanism drives the buffer mechanism to downwards press the films to form buffer sections; when the cutting mechanism cuts the films, the buffer mechanism can be quickly ascended along with descending of the cutting mechanism without needing the films to bear the weight thereof; and meanwhile, the edge pressing mechanism can press two side edges of the films for fixation, so that the cutting mechanism can accurately and quickly cut the films, the technical problem of pull deformation of the films in the cutting process due to punching force and tension is solved, and the functions of film buffering and automatic cutting positioning are realized.

Description

[0001] machine technology [0002] The invention relates to the technical field of film cutting, in particular to a high-precision film cutting device for film production. Background technique [0003] After the film is shaped and rolled, it is necessary to re-cut the rolled film to obtain a film of the required size for composite use. During the cutting process, the film is cut on the cutting machine with the same frequency and intermittent twitching, section by section. Cut into finished film, and in the cutting process, due to the strong plasticity of the film, if the film is in a tight state, it is easy to pull the film and partially deform it due to the punching force and tension during the cutting process. , affecting the use of later films. [0004] In the Chinese patent with the patent number CN105966962A, a film cutting machine is disclosed. By setting a buffer device between the guide rollers, the film forms a buffer at one end during the cutting process to prevent ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D1/08B26D7/02B26D7/06B26D5/12B26D7/08
CPCB26D1/085B26D5/12B26D7/025B26D7/06B26D7/08B26D2007/082
Inventor 金庭峰
Owner 浙江班萘特复合材料股份有限公司
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