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A quick way to check the overlapping of silkscreen and soldermask

A rapid inspection and solder mask technology, applied in the fields of instruments, calculations, electrical and digital data processing, etc., can solve the problems of easy omission and low efficiency, and achieve the effect of avoiding omissions and errors, improving efficiency, and orderly and accurate inspection results.

Active Publication Date: 2020-04-03
GUANGDONG INSPUR BIG DATA RES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide and design a method for quickly inspecting the overlapping of the silk screen layer and the solder mask layer to solve the above-mentioned problems

Method used

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  • A quick way to check the overlapping of silkscreen and soldermask
  • A quick way to check the overlapping of silkscreen and soldermask

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Embodiment Construction

[0028] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The following embodiments are explanations of the present invention, but the present invention is not limited to the following embodiments.

[0029] This embodiment provides a method for quickly checking the overlapping of the silk screen layer and the solder mask layer. First, write a skill program for quickly checking the overlap of the silk screen layer and the solder mask layer, such as figure 1 As shown, the steps to write the skill program are as follows:

[0030] Step 11: First make the entire design invisible, and open the layers related to the solder mask layer and the silk screen layer;

[0031] Step 12: Select all objects with different types on the solder mask layer and silk screen layer;

[0032] Step 13: Traverse each object in the silk screen layer and solder mask layer, and obtain the airgap measurement distance between two objec...

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Abstract

The invention relates to a method for rapidly checking stacking of a silk-screen layer and a solder mask layer. The method is characterized in that a program for rapidly checking stacking of the silk-screen layer and the solder mask layer is complied, then, some configuration files of software are modified, and the program for rapidly checking stacking of the silk-screen layer and the solder mask layer and shortcut key related programs are added and loaded; the software is opened, shortcut keys are pressed, the stacked silk-screen layer and the solder mask layer can be rapidly checked, highlighting is performed on the stacked portion, an inspection report is popped up, coordinated indexes contained in the report are inspected, the stacked portion is rapidly positioned, modification is performed one by one, and the stacking phenomenon of the silk-screen layer and the solder mask layer is rapidly inspected, so that the process of designing and checking is greatly simplified, the efficiency is improved, and meanwhile omission and mistakes possibly caused by macrography are avoided.

Description

technical field [0001] The invention belongs to the technical field of PCB design, and in particular relates to a method for quickly checking the overlapping of a silk screen layer and a solder resist layer. Background technique [0002] There are many kinds of PCB design software on the market. As the most widely used software in the industry, Allegro not only has powerful functions and a variety of related software as support, but also because it provides an open secondary development interface and relatively complete The development language library, users can develop according to their own needs. [0003] Skill language is a high-level programming language based on C language and LISP language built into Allegro software. Allegro provides rich interactive functions for skill language. Researching skill language and then writing tools can greatly improve work efficiency. [0004] In PCB design inspection, the inspection method currently used is manual inspection, which i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F30/398
CPCG06F30/398
Inventor 张敏
Owner GUANGDONG INSPUR BIG DATA RES CO LTD