Miniature camera device and manufacturing method thereof

A production method and camera technology, applied in the field of camera, can solve the problems of camera particle contamination, non-compliance with lightness, thinness, small size, and large camera module size, so as to reduce the space occupied, reduce the risk of particle contamination, enhance the The effect of reliability

Pending Publication Date: 2017-07-28
KUNSHAN Q TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the size of the camera module with this structure is large, which does not conform to the development trend of light, thin and small electronic products (mo

Method used

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  • Miniature camera device and manufacturing method thereof
  • Miniature camera device and manufacturing method thereof
  • Miniature camera device and manufacturing method thereof

Examples

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Embodiment Construction

[0025] In order to understand the technical content of the present invention more clearly, the following examples are given in detail, the purpose of which is only to better understand the content of the present invention but not to limit the protection scope of the present invention.

[0026] Such as figure 1 , figure 2 with image 3 As shown, a miniaturized camera device, a miniaturized camera device, includes a circuit board 1, a photosensitive chip 2, a filter 3, a bracket 4 and a lens assembly 5, and the photosensitive chip is attached to the circuit board , the bracket includes a bracket body 41 and an annular boss 42 formed at the bottom of the bracket body. The peripheral non-photosensitive areas are bonded together, and the support, the annular boss, the photosensitive chip and the circuit board are combined into a whole through a plastic package 6 formed of a plastic packaging material, and the plastic package is combined with the The outer side of the bracket, t...

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PUM

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Abstract

The invention discloses a miniature camera device comprising a circuit board, a photosensitive chip, an optical filter, a bracket and a lens component, wherein the photosensitive chip is laminated on the circuit board, the bracket comprises a bracket main body and an annular boss used for forming the bottom of the bracket main body, a light hole penetrating through the annular boss is formed in the middle of the bracket main body, the annular boss and a non-photosensitive area on the periphery of the photosensitive chip are adhered together, the bracket, the annular boss, the photosensitive chip and the circuit board are combined into an entirety by a plastic package body made of a plastic package material, the plastic package body is combined with the outer side of the bracket, the outer side of the annular boss, the peripheral side of the photosensitive chip and the upper side of the circuit board, the lens component is installed on the upper side of the bracket and/or the upper side of the plastic package body, the optical filter is arranged between the lens component and the photosensitive chip and is installed at the light hole in the middle of the bracket. The miniature camera device disclosed by the invention reduces the size of the camera module, reduces the risk of particle soiling in the camera and enhances the reliability of the product.

Description

technical field [0001] The invention relates to the technical field of photography, in particular to a miniaturized camera device and a manufacturing method thereof, which can be preferably applied to mobile phones or tablet computers. Background technique [0002] At present, a camera module generally includes an image sensor (photosensitive chip), a circuit board (RFPC), a bracket, a filter, and a lens assembly with a lens. The image sensor is installed on the circuit board (the hard board part of the RFPC) through Die Bond and Wire Bond processes, the bracket is installed above the image sensor on the circuit board, the lens assembly is installed on the bracket, and the filter The light sheet sits between the lens assembly and the image sensor and is mounted in the middle of the bracket. However, the size of the camera module with this structure is large, which does not conform to the development trend of light, thin and small electronic products (mobile phones, tablet c...

Claims

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Application Information

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IPC IPC(8): H04N5/225
CPCH04N23/54H04N23/50H04N23/57H04N23/55
Inventor 许杨柳金元斌邓爱国
Owner KUNSHAN Q TECH CO LTD
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