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A sensing diaphragm and mems microphone

A sensing film and sensitive technology, applied in the direction of diaphragm structure, sensor, measurement device, etc., can solve the problems of poor dynamic stability of the diaphragm, reduce the effective area of ​​the diaphragm, and affect the low-frequency characteristics of the diaphragm, and achieve good dynamic stability. Effect

Active Publication Date: 2020-11-20
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure of the pressure relief hole will reduce the effective area of ​​the diaphragm; the structure of the pressure relief valve set on the diaphragm will directly affect the vibration characteristics of the diaphragm, especially the low-frequency characteristics of the diaphragm, and the dynamic stability of the diaphragm is relatively poor

Method used

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  • A sensing diaphragm and mems microphone
  • A sensing diaphragm and mems microphone
  • A sensing diaphragm and mems microphone

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Embodiment Construction

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0026] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0027] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

A sensing diaphragm and an MEMS microphone. The sensing diaphragm comprises a sensitive part (2) located in a middle area, and a fixing part (5) located at the edge of the outer side of the sensitive part (2) and integrally formed with the sensitive part (2); the sensing diaphragm further comprises a gap part (4) that extends from the fixing part (5) to the edge position of the sensitive part (2) and is not closed; the gap part (4) forms, on the sensing diaphragm, a holding part (3) with a root part located at the fixing part (5) and a free end extending to the upper edge position of the sensitive part (2); the sensitive part (2) is configured to move relative to the holding part (3) when being impacted, so as to form an airflow channel between the holding part (3) and the sensitive part (2). Compared with a conventional pressure relief valve structure, the sensing diaphragm has less influence on the vibration characteristic of the sensitive part, so that the sensitive part has better dynamic stability.

Description

technical field [0001] The invention relates to a sensing diaphragm, in particular to a vibrating membrane suitable for sound generation; the invention also relates to a MEMS microphone. Background technique [0002] MEMS sensing components have been widely used in consumer electronics products. How to speed up the product production process is the focus of component suppliers. For example, the dust generated during the production and assembly of mobile phones is directly cleaned by air guns. The lowest cost option. Therefore, for MEMS sensors, it is necessary to propose a large-pressure or atmospheric-pressure anti-blow improvement plan to avoid rupture and failure of the microphone due to air gun cleaning during the assembly process. [0003] For example, in the field of microphones, the current improvement solution is to provide a pressure relief hole or a pressure relief valve structure on the diaphragm of the MEMS microphone. However, the structure of the pressure rel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01H11/08H04R1/08H04R19/04H04R7/04
CPCG01H11/08H04R1/083H04R7/04H04R19/04H04R2201/003
Inventor 詹竣凱周宗燐蔡孟錦王宇
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD
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