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Full automatic electroplating production line

An electroplating production line, fully automatic technology, applied to circuits, electrolytic processes, electrolytic components, etc., can solve the problems of manual loading and unloading, inconsistent electroplating quality, and inability to achieve electroplating effects, etc., to achieve the effect of reducing labor intensity and improving work efficiency

Inactive Publication Date: 2017-08-04
DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a fully automatic electroplating production line, which not only overcomes the defects of non-uniform electroplating quality and manual loading and unloading existing in the traditional gantry electroplating method, but also overcomes the inability to achieve high-aspect-ratio workpieces in the traditional vertical continuous electroplating method. Defects in electroplating effect

Method used

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Effect test

Embodiment 1

[0032] This embodiment provides a fully automatic electroplating production line, which can not only realize automatic loading and unloading, but also ensure that the electroplating quality of all workpieces is uniform, and can also achieve good electroplating effects for workpieces with high aspect ratios.

[0033] see figure 1 , The automatic electroplating production line of this embodiment includes: several movable plating parts loading mechanisms, return mechanisms and electroplating devices.

[0034] The plated piece loading mechanism is used to load the plated pieces 6 to be electroplated and arranged in sequence for use;

[0035] The electroplating device is used to perform loading, electroplating pre-treatment, electroplating, electroplating post-treatment, and blanking operations on the plated piece 6 in sequence, so as to complete the entire electroplating process for the plated piece 6;

[0036] The return mechanism is used to automatically return the loading mech...

Embodiment 2

[0056] In Embodiment 1, there is only one row of electroplating devices in the entire automatic electroplating production line, and only one row of electroplating tanks 14 with relatively large capacity is provided on the electroplating station 9 of the electroplating device, which can accommodate several plating pieces 6 . And in the second embodiment, in order to improve work efficiency to the greatest extent, N rows of parallel electroplating devices can be set to work at the same time in the electroplating production line, and M rows of electroplating tanks 14 can be set in each row of electroplating devices, N≥1, M≥1 . . At this time, the working principle is completely the same as that in the first embodiment, and will not be repeated here.

Embodiment 3

[0058] In the first embodiment, the return mechanism and the electroplating device are arranged up and down. However, in the third embodiment, it is preferable that the return mechanism and the electroplating device are arranged horizontally. In the up-and-down arrangement / horizontal arrangement, the return mechanism is kept parallel to the electroplating device.

[0059] When adopting the horizontal setting method, the first lift car 20 / second lift car 21 reciprocates on the horizontal track between the loading station 7 / unloading station 11 and the roller conveying line 22, so as to load the idle plating parts The mechanism is delivered to the loading station 7 by the roller conveyor line 22 / delivered to the roller input line by the blanking station 11.

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Abstract

The invention discloses a full automatic electroplating production line which comprises a plurality of plating piece loading mechanisms, an electroplating device and a pass back mechanism. The plating piece loading mechanisms comprise a conductive rod, a swing support and a swing driving piece, the conductive rod is assembled on the swing support, and the swing driving piece is connected with the swing support; the electroplating device comprises a feeding station, an electroplating pretreatment station, an electroplating station, an electroplating aftertreatment station, a discharging station and a plating piece conveying mechanism; the feeding station is provided with a feeding mechanical arm, the electroplating station is provided with a plurality of electroplating grooves capable of containing a plurality of plating pieces, and a discharging mechanical arm is arranged on the discharging station; and the pass back mechanism runs from the outside side of the discharging station to the inlet side of the feeding station, and the discharged plating piece loading mechanisms are sent from the discharging station to the feeding station. According to the embodiment, full automatic electroplating is achieved, the unified electroplating quality of all plating pieces can be kept, the full automatic electroplating production line is suitable for plating pieces with large aspect ratio, automatic feeding and discharging operation is achieved, the labor intensity is reduced, and the working efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an automatic electroplating production line. Background technique [0002] Vertical Conveyor Plating (Vertical Conveyor Plating, referred to as VCP) is a full board (primary) copper plating production line that uses spray copper plating technology and vertical continuous conveying device in the production of printed circuit boards (Printed Circuit Board, referred to as PCB). The electroplating efficiency; during the electroplating process, the circuit board is clamped on the fixture, and all the workpieces are continuously moved from one side of the electroplating tank to the other side driven by the mobile device. The production conditions of each workpiece are exactly the same, and the circuit board is in The electroplating tank moves continuously, without leaving the chemical solution or being exposed to the air. [0003] The linear gantry electroplating production lin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D7/12C25D19/00
Inventor 蔡志浩赵喜华
Owner DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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