Wafer edge measuring module

Abstract

A wafer edge measuring module comprises at least one linear scanning camera, at least one convex lens group, at least one reflector group and at least one light source component groups. The linear scanning camera is erected in a predetermined positioned in the wafer edge; the convex lens group is positioned in front of the linear scanning camera, so that the linear scanning camera scans the intermediate-end edge of the wafer edge linearly after transmitting the convex lens group; the reflector group is close to the wafer edge, and is composed of first and second reflectors, and a reflection side is forward; light sources of the light source component groups are projected to pixels, to be scanned linearly, in the upper inclined surface edge, intermediate-end edge and lower inclined surface edge of the wafer edge to form different dark-field light sources respectively, all pixels in the wafer edge are presented in a low-grayscale area, and if a high-grayscale area is presented when the linear scanning camera scans part of pixels in the wafer edge linearly, the high-grayscale area represents a defect of the wafer edge. Thus, the wafer edge measuring speed is improved, and the defect can be discovered timely.

Description

technical field [0001] The invention relates to a wafer edge measurement module, especially an integrated linear scanning camera, convex lens, reflector and dark field light source, which can also increase the speed of wafer edge measurement and detect defects in real time. Background technique [0002] In the past, for mass-produced wafer measurement, most of them used a lot of manpower and used many different measuring tools to do the measurement work manually. This manual inspection method, in addition to the disadvantages of high personnel costs, inspection work with human eyes, not only has problems such as boring, eye fatigue, and high turnover rate of personnel, but also the stability of quality is also a problem. Issues worthy of discussion, therefore, gradually replace artificial vision with machine vision. In terms of industrial cameras, they are distinguished by imaging principles, mainly including line-scanning and surface-line scanning technologies. Arranged in...

AI Technical Summary

Problems solved by technology

[0003] Secondly, the wafer measurement is mainly on the effective area, not the invalid area. Usually the edge of the wafer belongs to the invalid area, rather than the focus of the measurement. However, due to the gradual vitrification and expansion of the wafer material, if the wafer edge appears Defects are processed, transferred, and transported in the multiple process steps of lithography, diffusion, cleaning, chemical mechanical polishing, and chemical vapor deposition. effective area, so wafer edge defects have quietly become yield-limiting defects

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