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Preparation method of fiberboard adhesive

A technology of sheet glue and adhesive, which is applied in the direction of adhesives, adhesive types, aldehyde/ketone condensation polymer adhesives, etc., can solve the problems of low-cost and effective method manufacturing, and achieve the reduction of formaldehyde content and simple process Reasonable and ensure the effect of environmental stability

Inactive Publication Date: 2017-08-11
曾华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no low-cost and effective method to manufacture adhesives that meet E0 grade boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The quantities of various chemical reagents used are: industrial formaldehyde solution 50%, urea 40%, melamine: 3%, water 2%, triethylamine: 0.02%, formic acid 0.01%, caustic soda 0.01%

[0024] 1. Mix industrial formaldehyde solution and water evenly in the reactor, use steam to heat up to 38°C, then add caustic soda to adjust the pH value to 7.8;

[0025] 2. Add melamine and urea;

[0026] 3. Continue to use steam to heat, stop heating when the temperature rises to 83°C, let it rise to 86°C naturally, and then start timing and keeping warm for 25;

[0027] 4. Add formic acid, adjust the pH value to 5.0, then test the viscosity of the polycondensation point every 5 minutes, and control the polycondensation temperature at 86°C, and the polycondensation time is 60 minutes;

[0028] 5. After the polymerization viscosity reaches the set threshold, add triethylamine and caustic soda to adjust the pH value to 5.5;

[0029] 6. After the temperature of the reactor drops to 8...

Embodiment 2

[0036] The quantities of various chemical reagents used are: industrial formaldehyde solution 55%, urea 45%, melamine: 5%, water 4%, triethylamine: 0.05%, formic acid 0.05%, caustic soda 0.05%.

[0037] 1. Mix industrial formaldehyde solution and water evenly in the reactor, use steam to heat up to 42°C, then add caustic soda to adjust the pH value to 8.2;

[0038] 2. Add melamine and urea;

[0039] 3. Continue to use steam to heat, stop heating when the temperature rises to 87°C, let it rise to 90°C naturally, and start timing and keeping warm for 35 minutes;

[0040] 4. Add formic acid, adjust the pH value to 5.3, and then test the viscosity of the polycondensation point every 5 minutes, while controlling the polycondensation temperature at 90°C, and the polycondensation time is 80 minutes;

[0041] 5. After the polymerization viscosity reaches the set threshold, add triethylamine and caustic soda to adjust the pH value to 5.8;

[0042] 6. After the temperature of the reac...

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PUM

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Abstract

The invention discloses a preparation method of a fiberboard adhesive. The preparation method comprises the following steps that formaldehyde and water are mixed, and after the temperature is raised to 38-42 DEG C, an alkaline reagent is added to adjust the PH value to be 7.8-8.2; melamine and urea are added; heating is conducted, and when the temperature is raised to 83-87 DEG C, the temperature is naturally raised to 86-90 DEG C; an acid reagent is added to adjust the PH value to be 5.0-5.3, and the viscosity of a condensation point is tested every five minutes; after the viscosity reaches a set threshold, triethylamine and the alkaline reagent are added to adjust the PH value to be 5.5-5.8; after the temperature is reduced to 80-84 DEG C, urea is added again; after 15-25 minutes, the alkaline reagent is added to adjusted the PH value to be 7.1-7.6 after the viscosity is tested; melamine and urea are added again, and after the temperature is reduced to 55-65 DEG C, urea is added again; the temperature is reduced to 55-65 DEG C, the alkaline reagent is added to adjust the PH value to be 7.5-8.3, and the addition of the alkaline reagent is stopped after the viscosity reaches the set threshold; the temperature is reduced to 40 DEG C to discharge glue. The preparation method of the fiberboard adhesive is low in production cost and safe and stable in production process, and the formaldehyde discharge amount of the prepared adhesive meets high-standard environmental requirements.

Description

technical field [0001] The invention relates to the technical field of manufacturing new environment-friendly polymer materials, in particular to a preparation method of a fiberboard adhesive. Background technique [0002] Urea-formaldehyde glue is usually used in the production process of ordinary density board, and urea-formaldehyde glue is a formaldehyde compound, which makes the density board inherently contain formaldehyde. In order to reduce the amount of formaldehyde, manufacturers have to add other substances that decompose formaldehyde, but at the same time increase the production cost of density boards. Therefore, an adhesive is needed that can produce boards that meet the standards without adding other substances. [0003] Internationally, man-made fiberboards are divided into three levels: E2, E1, E0, and NAF according to the level of formaldehyde emission, namely E2≤30.0mg / 100g, E1≤8.0 (national standard 9.0)mg / 100g, E0≤5.0mg / 100g, NAF≤0.04ppm. Furniture produ...

Claims

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Application Information

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IPC IPC(8): C08G12/38C09J161/30
CPCC08G12/38C09J161/30
Inventor 曾华
Owner 曾华
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