A display panel, its manufacturing method and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device. After the chip-on-chip film is pasted on the side away from the display surface of the display substrate by using an adhesive glue, and then arranged at least through the display substrate, each signal The conductive material in the connection hole between the line and the insulating layer can realize the connection between the signal line around the display surface of the display substrate and the connection terminal provided on the chip-on-chip film. Therefore, the bending process of the connection terminal is omitted, so that the display panel There is no connecting terminal bending area around the periphery of the display panel, so that the frame of the display panel is narrower. And, because the insulating layer is provided with a plurality of depressions around each connection hole, it can ensure that the conductive material is in contact with the surface of the signal line in the depression, which increases the contact area between the conductive material and the signal line, and prevents holes and conductive material from forming. Fill the risk of failure, thereby improving the yield of the product.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel, a manufacturing method and a display device. Background technique [0002] With the continuous advancement of display technology, display panels are more and more widely used in display products. Display products with narrow bezels (Narrow Bezel) have attracted a large number of consumers because they can enable users to obtain a better viewing experience. [0003] Currently, bending the connection terminals is the only solution to realize display products with narrow bezels. However, there are many problems with the yield rate of the display products manufactured by the connecting terminal bending process. For example, in the Figure 1a The shown display product when bent, such as Figure 1b The inorganic insulating layer in the bending region P of the connecting terminal shown is prone to cracks, which will lead to display failure. In the prior art, a mask ...

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Problems solved by technology

In this way, although the display failure phenomenon caused by cracks in the inorganic insulating layer is avoided to a certain extent, two Mask processes are added, which increases the difficulty of the process and the manufacturing cost, and reduces the production efficiency.

In addition, the formation of the connecting terminal bending area P needs to increase the space, and compared with the display products of the same size without the connecting terminal bending process, the utilization rate of the substrate substrate is lower for the display products manufactured using the connecting terminal bending process. Low

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