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Display panel manufacturing method, display panel manufacturing equipment, and display panel

A technology for a display panel and a manufacturing method, which is applied in the manufacturing of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of inability to form organic semiconductor material semiconductor layer patterns, contamination of organic semiconductor materials, etc.

Active Publication Date: 2019-05-14
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problem in the prior art that a semiconductor layer pattern made of an organic semiconductor material cannot be formed by a traditional photolithography process because the photoresist may contaminate the organic semiconductor material, an embodiment of the present invention provides a display panel manufacturing method, Display panel manufacturing equipment and display panel

Method used

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  • Display panel manufacturing method, display panel manufacturing equipment, and display panel
  • Display panel manufacturing method, display panel manufacturing equipment, and display panel
  • Display panel manufacturing method, display panel manufacturing equipment, and display panel

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Embodiment Construction

[0056] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0057] like figure 1 As shown, it is a schematic diagram of the principle of controlling the movement of semiconductor material droplets through the principle of electrowetting (English: Electrowetting) in the embodiment of the present invention. Wherein, an electrowetting electrode 02 and an insulating layer 03 are sequentially formed on the substrate layer 01 , and the electrowetting electrode 02 includes an electrode 021 , an electrode 022 and an electrode 023 . Droplets 04 may be provided on the insulating layer 03 .

[0058] When a voltage is applied to the electrode 022 but not to the electrode 021, the voltage on the electrode 022 is greater than the voltage on the electrode 021, and there is an electric field passing through t...

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PUM

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Abstract

The invention discloses a display panel manufacturing method, display panel manufacturing equipment and a display panel, and belongs to the field of display technology. The method includes: forming a plurality of semiconductor material droplets on a base substrate through microfluidic technology; performing curing treatment on the plurality of semiconductor material droplets, and forming the semiconductor material droplets after curing treatment. layer pattern. In the present invention, a semiconductor layer pattern is formed on a base substrate through microfluidic technology, without using photoresist. It solves the problem in the related art that the traditional photolithography process cannot be used to form the semiconductor layer pattern made of the organic semiconductor material because the photoresist may contaminate the organic semiconductor material. The effect is achieved that various semiconductor materials can be used to form the semiconductor layer pattern.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display panel manufacturing method, display panel manufacturing equipment and the display panel. Background technique [0002] The display panel usually includes a plurality of thin film transistors (English: Thin Film Transistor; TFT for short), and these TFTs can control the display panel differently according to different types of the display panel. A TFT generally includes a gate, an active layer, and a source-drain (the source-drain includes a source and a drain). [0003] In the related art, when manufacturing a display panel, a gate conductive pattern and a gate insulating layer are first formed on a base substrate, and then an active layer pattern is formed on the base substrate with a gate insulating layer through a mask process, and then the Other structures are formed on the base substrate of the active layer pattern. [0004] In the process of realizing t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/40H01L27/28
CPCH10K19/10H10K71/20H10K71/12
Inventor 冯翔杨瑞智刘莎乔赟孙晓邱云张强杨照坤王瑞勇尤杨
Owner BOE TECH GRP CO LTD