Miniature camera device with directly adhered optical filter and manufacturing method thereof

Abstract

The invention discloses a miniature camera device comprising a circuit board, a photosensitive chip, an optical filter and a lens component, wherein the photosensitive chip is adhered on the middle of the circuit board, a passive element and a gold thread are arranged on the circuit board on the surrounding of the photosensitive chip, a circle of annular blocking edge surrounding the photosensitive chip is formed on a non photosensitive area of the photosensitive chip, a plastic package body for wrapping the passive element and the gold thread is formed on the photosensitive chip beyond the annular blocking edge and the circuit board through a plastic package material, a sinking groove is formed in the middle of the upper side of the plastic package body, the periphery of the optical filter is adhered in the sinking groove, therefore a light through hole is aligned to the photosensitive area of the photosensitive chip; and the lens component is installed on the upper side of the plastic package body. According to the miniature camera device disclosed by the invention, the plastic package body replaces the traditional bracket, the sinking groove is reserved in the plastic package body, and the optical filter is directly adhered in the sinking groove, thereby reducing the size of the camera module, and as the passive element and the gold thread on the periphery of the photosensitive chip are entirely cast in the plastic package body, the reliability of the product is enhanced.

Description

Technical field [0001] The present invention relates to the field of imaging technology, in particular to a miniaturized camera device with directly attached filters and a manufacturing method thereof, which can be better applied to the fields of mobile phones or tablet computers. Background technique [0002] At present, the camera module usually includes an image sensor (photosensitive chip), a circuit board (flex-hard board RFPC), a bracket, a filter, and a lens assembly provided with a lens. The image sensor is mounted on the circuit board (the hard board part of the RFPC) through die bond and wire bond processes. The bracket is mounted on the circuit board and covered above the image sensor. The lens assembly is mounted on On the bracket, the filter is located between the lens assembly and the image sensor, and is installed in the middle of the bracket. However, the size of the camera module with this structure is relatively large, which does not conform to the development ...

AI Technical Summary

Problems solved by technology

However, the size of the camera module with this structure is large, which does not conform to the development trend of light, thin and small electronic products (mobile phones, tablet computers, etc.), and the product reliability needs to be further strengthened.

Images