Full-automatic BGA solder ball preparation device
A preparation device and fully automatic technology, which is applied in the field of automatic BGA solder ball preparation devices, can solve the problems of low solder ball ratio, jet fracture, high requirements, etc.
Active Publication Date: 2017-08-22
JIANGSU ZHEHONG SCI & TECH CO LTD
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Problems solved by technology
[0002] For precision solder balls for BGA packaging, the piezoelectric vibration method commonly used abroad has high vibration frequency, strong vibration amplitude, and good sealing performance. It has considerable advantages in the solder ball preparation process. However, the vibration frequency adjustment range of this method is extremely limited It is very difficult to ensure that various parameters are quite stable during the jet preparation process. Therefore, the requirements for equipment working conditions and control technology are very high; in addition, during the operation of the piezoelectric transducer, due to the influence of temperature, Its resonance frequency will drift, and the drift of resonance frequency will seriously affect the jet fracture effect. Therefore, under ideal conditions, although the particles can be guaranteed to be in a regular spherical shape, the proportion of solder balls with a single particle size is very low, and the separation process is difficult. The process is long and it is easy to damage the surface quality of solder balls
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[0013] A fully automatic BGA solder ball preparation device, including a metal mixer 1, a metal melting furnace 2, a tundish 3, a solidification chamber 10, a collection tank 11, a cleaning chamber 4, a drying chamber 5, and a solder ball sorting machine connected in sequence 6 and PLC control system 9, the metal powder enters the metal mixer 1 through the feed inlet 1.3 on the top of the metal mixer 1, and the agitator 1.2 fully mixes the metal powder, and the weighing module 1.1 can accurately measure the weight of each metal powder , the agitator 1.2 and the weighing module 1.1 are all connected with the PLC control system 9, and after being fully mixed, the metal powder is discharged from the discharge port 1.4 at the bottom of the metal mixer 1 and enters the metal melting furnace 2; The metal smelting furnace is filled with inert gas, and an air inlet valve 2.1 and a gas flow detector 2.2 are arranged on the inlet pipe, and the inlet valve 2.1 and the gas flow detector 2....
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The invention provides a full-automatic BGA solder ball preparation device. The full-automatic BGA solder ball preparation device comprises a metal mixer, a metal smelting furnace, a tundish, a solidification chamber, a collection tank, a cleaning chamber, a drying chamber, a solder ball sorting machine and a PLC control system, wherein the metal mixer, the metal smelting furnace, the tundish, the solidification chamber, the collection tank, the cleaning chamber, the drying chamber, the solder ball sorting machine and the PLC control system are connected in sequence. According to the full-automatic BGA solder ball preparation device, a flow guide pipe is connected with an electromagnetic vibration exciter, the electromagnetic vibration exciter is connected with the PLC control system, the PLC control system is provided with an adjuster which can be used for adjusting the amplitude, the frequency and the wavelength, and cut-off of metal jet flow is controlled by achieving signal modulation of the electromagnetic vibration exciter. The PLC control system is used for monitoring the whole device and controlling operation of the device, and thus full-automatic control over the ball preparation process is achieved; and unqualified solder balls and exhausted waste gas can be recycled.
Description
technical field [0001] The invention relates to the field of BGA solder ball production, in particular to a fully automatic BGA solder ball preparation device. Background technique [0002] For precision solder balls for BGA packaging, the piezoelectric vibration method commonly used abroad has high vibration frequency, strong vibration amplitude, and good sealing performance. It has considerable advantages in the solder ball preparation process. It is very difficult to ensure that various parameters are quite stable during the jet preparation process. Therefore, the requirements for equipment working conditions and control technology are very high; in addition, during the operation of the piezoelectric transducer, due to the influence of temperature, Its resonance frequency will drift, and the drift of resonance frequency will seriously affect the jet fracture effect. Therefore, under ideal conditions, although the particles can be guaranteed to be in a regular spherical sh...
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IPC IPC(8): B22F9/08
CPCB22F9/082B22F2009/0836
Inventor 刘克宽雷阿达吴小平
Owner JIANGSU ZHEHONG SCI & TECH CO LTD