Low-cost intelligent chip carrier band and manufacturing method therefor

Abstract

The invention discloses a low-cost intelligent chip carrier band and a manufacturing method therefor, and belongs to the technical field of intelligent chip packaging. The low-cost intelligent chip carrier band comprises a carrier band base material (5); a surface conductive layer is formed on the upper surface of the carrier band base material (5); the surface conductive layer is divided into multiple contact blocks at intervals by insulating trenches (4); the surface metal layer comprises a bottom metal layer and a contact metal layer arranged on the upper surface of the bottom metal layer; the low-cost intelligent chip carrier band is characterized in that welding holes (10) corresponding to the contact blocks are formed in the lower surface of the carrier band base material (5); an intra-hole metal layer fitted with the surface conductive layer is formed in the welding holes (10); a cavity hole (8) is formed in the middle part of the carrier band base material (5); and an insulating layer is arranged on the upper surface of the cavity hole (8). According to the low-cost intelligent chip carrier band and the manufacturing method therefor, the intra-hole metal layer is not formed in the cavity hole for fixing chips, so that the cost is greatly lowered.

Description

technical field [0001] A low-cost intelligent chip carrier tape and a manufacturing method belong to the technical field of intelligent chip packaging. Background technique [0002] With the development of integrated circuits and the improvement of people's living standards, the application of smart cards has become more and more extensive. It has been widely used in telecommunications, banking, social security, logistics and other fields. The general process of the smart card is: fix the chip on the carrier tape, then weld the terminals on the chip and the corresponding terminals on the carrier tape, and then solidify and package the chip and its surrounding welding wires. [0003] In recent years, under the market prospect of miniaturization of electronic products, the thinning of smart cards has become a current trend. In order to reduce the package height of the module, an accommodating cavity for placing the chip is opened on the carrier tape, and the chip is fixed in ...

AI Technical Summary

Problems solved by technology

However, the mold design is complicated, and the versatility of the mold is low for different products. Different products basically need to customize different molds to match them. The price is high, and the process control is difficult, the mold coverage rate is low, and the material at the cavity position is soft. , when the force is uneven, it is easy to cause the deformation of the cavity, resulting in a decrease in yield

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