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Wafer inspection device, inspection method, and semiconductor device manufacturing method

A technology of inspection device and inspection method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, measuring device, etc., and can solve the problems of judgment and inability to penetrate to the back, etc.

Active Publication Date: 2020-08-14
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is impossible to judge whether the detected crack penetrates from the surface of the wafer to the back surface.

Method used

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  • Wafer inspection device, inspection method, and semiconductor device manufacturing method
  • Wafer inspection device, inspection method, and semiconductor device manufacturing method
  • Wafer inspection device, inspection method, and semiconductor device manufacturing method

Examples

Experimental program
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Effect test

Embodiment approach 1

[0023] figure 1 It is a sectional view of the wafer inspection apparatus 100 in Embodiment 1 of the present invention. The wafer inspection apparatus 100 has a stage 14 . The workbench 14 is a frame with an open upper surface. A wafer holding table 12 for holding a wafer 10 is arranged on the upper surface of the table 14 . Here, semiconductor devices to be inspected are formed on the wafer 10 . The table 14 and the wafer holding table 12 constitute a wafer holding mechanism 16 .

[0024] A notch 13 is provided on the wafer holding table 12 . During inspection, the wafer 10 is placed on the bottom surface of the notch portion 13 . As a result, the outer peripheral portion of the wafer 10 is held by the wafer holding table 12 .

[0025] In a space 18 surrounded by the wafer holding mechanism 16 and the wafer 10 , a light source 20 is arranged on the bottom surface of the table 14 . The light source 20 irradiates light including irradiating light to the rear surface 102 o...

Embodiment approach 2

[0039] Figure 4 It is a sectional view of the wafer inspection apparatus 200 in the second embodiment. In this embodiment, the wafer inspection apparatus 200 has a pressure adjustment unit 230 . The pressure regulator 230 pressurizes the space 18 surrounded by the wafer holding mechanism 216 and the wafer 10 . In this embodiment, the pressure regulator 230 pressurizes by filling the space 18 with gas. At this time, the pressure of the space 18 is adjusted according to the thickness of the wafer 10 . In the present embodiment, the pressure difference from before pressurization is set to be 0.5 kPa or less.

[0040] The wafer holding table 212 has a vacuum suction hole 231 . A vacuum pump (not shown) is connected to the vacuum suction hole 231 . The vacuum suction holes 231 are depressurized by a vacuum pump. As a result, the outer peripheral portion of the wafer 10 is attracted to the wafer holding mechanism 216 . Thus, the space 18 is sealed. The vacuum suction hole 2...

Embodiment approach 3

[0045] Figure 5 It is a cross-sectional view of a wafer inspection apparatus 300 in the third embodiment. The wafer inspection apparatus 300 is the same as the wafer inspection apparatus 200 except that the pressure adjustment unit 230 is replaced by the temperature adjustment unit 332 . The temperature adjustment unit 332 adjusts the temperature of the wafer 10 . In this embodiment, stress is applied to the wafer 10 by heating the wafer 10 . As a result, the gap between the cracks expands. Therefore, by performing the light receiving step in a state where the wafer 10 is heated, it is possible to detect potential cracks similarly to the second embodiment.

[0046] The temperature adjustment unit 332 has a heater in the space 18 . The temperature of the wafer 10 is raised by heating the space 18 with the heater. In addition, the temperature adjustment unit 332 may be a temperature adjustment unit that blows air whose temperature has been adjusted in advance to the space ...

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Abstract

The present invention relates to a wafer inspection device, a wafer inspection method using the same, and a semiconductor device manufacturing method, and aims to obtain a wafer inspection device and a wafer inspection device that detect cracks penetrating from the front surface to the back surface of a wafer. method, and a method of manufacturing a semiconductor device using the inspection method. It has: a wafer holding mechanism, which is used to hold the wafer; a light source, which is shielded by the wafer and irradiates the first surface of the wafer with the irradiating light passing through the crack, and the crack is emitted from the first surface of the wafer. penetrating from the first surface to the second surface; and a light receiving unit, which is provided on the second surface side, receives the irradiated light that has passed through the wafer, and emits light corresponding to the received irradiated light. Signal.

Description

technical field [0001] The present invention relates to a wafer inspection device, a wafer inspection method using the inspection device, and a semiconductor device manufacturing method. Background technique [0002] Patent Document 1 discloses a method of imaging scattered light from a wafer to detect cracks. Usually, in the surface layer of the wafer, stress is generated at the crack portion. Due to this stress, the deflection direction of the scattered light changes. The method described above detects cracks by detecting changes in deflection direction. [0003] Patent Document 1: International Publication No. 2011 / 062279 [0004] In the method disclosed in Patent Document 1, the presence or absence of cracks in the surface layer of the wafer is detected. Therefore, it cannot be judged whether the detected crack penetrates from the front surface of the wafer to the back surface. Contents of the invention [0005] The present invention was made in order to solve the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/12G01N21/9501H01L22/20H01L21/324H01L21/67098H01L21/67248H01L21/6838H01L22/24H01L22/30
Inventor 渡部俊一
Owner MITSUBISHI ELECTRIC CORP