Wafer slicer, roller module thereof, and method for slicing wafer

Abstract

A wafer slicer and a roller module thereof are provided. The wafer slicer comprises a feeding unit and the roller module. The roller module is used for driving a sawing wire to slice an ingot, and includes two spaced apart main rollers and an auxiliary roller. A horizontal plane is defined to pass through the rotating axes of the main rollers. Two vertical planes are defined to be perpendicular to the horizontal plane and respectively pass through the rotating axes. The auxiliary roller has a diameter smaller than one half of the diameter of each of the main rollers. The auxiliary roller is disposed above the horizontal plane and between the vertical planes. An uppermost side of the auxiliary roller is not lower than an uppermost side of each main roller. The main rollers and the auxiliary roller are adapted for the sawing wire to be wound thereon to form a wire net that spans over the main rollers and the auxiliary roller for slicing the ingot. Moderate support can be provided for the sawing wire to reduct vibration of the sawing wire, to achieve high slicing precision, and to avoid interference on saw ingot. The invention also provides a method for slicing the wafer.

Description

technical field [0001] The present invention relates to a wheel set structure, wafer slicing equipment and a slicing method, in particular to a wheel set structure suitable for a wafer slicer, a wafer slicer using the wheel set structure, and a wafer slicer Methods. Background technique [0002] refer to figure 1 , an existing wafer slicer 1 includes a pair of rollers 11 and a cutting wire 12 wound thereon. The cutting wire 12 is wound on the roller 11 and divided into a plurality of cutting wire segments 121 , and the cutting wire segments 121 are moved left and right by the forward and reverse rotation of the roller 11 to form several wire saws. When in use, one crystal rod 10 moves down and presses into the cutting line segment 121, and is cut into multiple wafers. [0003] With the evolution of the industry, the process of wafer slicing continues to improve, and the cutting wire 12 is gradually thinned, which can help reduce costs. However, under the same force, the w...

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Problems solved by technology

[0006] In addition, reducing the diameter of the roller 11 may also cause two problems: 1. The outer diameter of the roller 11 is reduced, so that the curvature of the axis around which the cutting line segment 121 is wound becomes larger. The cutting line segment 121 may generate a large stress on the roller 11, and it is easy to cut down the surface layer of the roller 11, and cause the position of part of the cutting line segment 121 to move down and unevenly distribute, thereby affecting the accuracy of wafer slicing, and detracting from the The service life of described roller 11

[0007] In addition, using the wafer slicer 1 to cut the ingot 10 is easy to obtain a wafer with a dirty surface, so that the subsequent cleaning process of the wafer needs more cleaning time, which is not conducive to the improvement of the overall production capacity.

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