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Manufacturing method of oled device, oled device and display panel

A device manufacturing method and device technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., to achieve the effects of reducing interference, reducing manufacturing costs, and reducing carrier transport capabilities

Active Publication Date: 2021-01-26
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the problem with this technical solution is that when applying a turn-on voltage to one of the unit devices of one color, due to the better carrier transport performance of HIL, and the large difference in lighting voltage between devices of different colors, that is, The voltage difference causes the directional transport of carriers, so that the unit devices of other colors are lit at the same time, and this situation is more serious at low gray scales

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  • Manufacturing method of oled device, oled device and display panel
  • Manufacturing method of oled device, oled device and display panel
  • Manufacturing method of oled device, oled device and display panel

Examples

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Embodiment Construction

[0039] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of the specific details being omitted, or other methods, components, devices, steps, etc. may be adopted. In other instances, well-known technical solutio...

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Abstract

The disclosure relates to a method for manufacturing an OLED device, an OLED device and a display panel. The method includes: forming a first electrode layer on a substrate; forming a pixel defining layer on the first electrode layer, the pixel defining layer having a plurality of openings corresponding to the light-emitting regions of each sub-pixel unit; defining the pixel roughen the surface of the layer away from the first electrode layer; form a hole injection layer covering the pixel defining layer and the opening; transport layer and second electrode layer. The disclosure can reduce the carrier transport capability of the hole injection layer, reduce the occurrence of crosstalk, reduce the interference to the evaporation process, and reduce the manufacturing cost.

Description

technical field [0001] The present disclosure relates to the field of display technology, in particular, to a method for manufacturing an OLED device, an OLED device and a display panel. Background technique [0002] In recent years, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode), as a new type of flat panel display technology, has gradually received more attention. Due to the characteristics of active light emission, high luminous brightness, high resolution, wide viewing angle, fast response speed, low energy consumption and flexibility, OLED has become a next-generation display technology that may replace liquid crystal display. [0003] In most current OLED device structures, commonly used RGB light-emitting unit structures share HIL (Hole Injection Layer, hole injection layer). The application of HIL as a common layer can save a mask process and simplify the process flow. However, the problem with this technical solution is that when the turn-on volt...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/35H10K50/17H10K59/122H10K71/231H10K71/60H10K50/11H10K50/15H10K50/16H10K50/81H10K50/171H10K71/00
Inventor 王丹李娜
Owner BOE TECH GRP CO LTD
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