Organic light-emitting diode (OLED) display panel encapsulation structure, manufacturing method of OLED display panel encapsulation structure, and display device
A technology of light-emitting diodes and display panels, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., and can solve the problems of reducing the service life of organic light-emitting diode devices, easily breaking glass retaining walls, and easily reducing adhesion, etc. Achieve the effects of improving packaging reliability, improving bonding reliability, and prolonging service life
A technology of light-emitting diodes and display panels, which is applied in the manufacture of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., and can solve the problems of reducing the service life of organic light-emitting diode devices, easily breaking glass retaining walls, and easily reducing adhesion, etc. Achieve the effects of improving packaging reliability, improving bonding reliability, and prolonging service life
CN107104201AActive Publication Date: 2017-08-29BOE TECH GRP CO LTD +1
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[0029] In order to further illustrate the packaging structure of the organic light emitting diode display panel provided by the embodiments of the present invention, its manufacturing method, and the display device, a detailed description will be given below in conjunction with the accompanying drawings.
[0030] refer to figure 1 , the organic light emitting diode display panel packaging structure provided by the embodiment of the present invention includes an organic light emitting diode display substrate 1 and a glass cover plate 2 arranged oppositely, the non-display area of the organic light emitting diode display substrate 1 and the corresponding non-display area of the glass cover plate 2 An encapsulation part is provided between the parts, and the organic light emitting diode device 3 of the organic light emitting diode display substrate 1 is located in a sealed cavity surrounded by the organic light emitting diode display substrate 1, the glass cover plate 2 and th...
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The invention relates to the field of display technologies, and discloses an organic light-emitting diode (OLED) display panel encapsulation structure, a manufacturing method of the OLED display panel encapsulation structure, and a display device, which are used to improve the sealing reliability of OLED device encapsulation and prolong the service life of OLED devices. The OLED display panel encapsulation structure comprises an OLED display substrate and a glass cover plate which are oppositely arranged, wherein encapsulation parts are arranged between non-display areas of the OLED display substrate and parts of the glass cover plate corresponding to the non-display areas; and each encapsulation part comprises a first concave-convex structure arranged on the OLED display substrate, a second concave-convex structure arranged on the glass cover plate, and encapsulation materials arranged between the first concave-convex structure and the second concave-convex structure. The OLED display panel encapsulation structure, the manufacturing method of the OLED display panel encapsulation structure, and the display device provided by the invention are used for an OLED display device.
Description
technical field [0001] The invention relates to the field of display technology, in particular to an organic light emitting diode display panel packaging structure, a manufacturing method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) devices are widely used in the display industry due to their advantages of high brightness, full viewing angle, fast response and flexible display. However, since the organic light emitting diode device is very sensitive to water and oxygen in the air, the water and oxygen that penetrate into the organic light emitting diode device will seriously affect the service life of the organic light emitting diode device. Therefore, the organic light emitting diode device needs to use The encapsulation structure is used for encapsulation, so as to block water, oxygen, etc. by using the encapsulation structure. [0003] At present, laser glass encapsulation (Frit encapsulation) is a commonly used encapsu...
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Patent Timeline
29 Aug 2017
Publication
CN107104201A
- IPC
- H01L51/52
- CPC
- H10K59/8792; H10K59/8722; H10K59/12; H10K50/8423; H10K50/844; H10K50/8426; H10K59/00; H10K71/00
- Inventors
- 吴守政; 张青