Organic light-emitting diode (OLED) display panel encapsulation structure, manufacturing method of OLED display panel encapsulation structure, and display device

Abstract

The invention relates to the field of display technologies, and discloses an organic light-emitting diode (OLED) display panel encapsulation structure, a manufacturing method of the OLED display panel encapsulation structure, and a display device, which are used to improve the sealing reliability of OLED device encapsulation and prolong the service life of OLED devices. The OLED display panel encapsulation structure comprises an OLED display substrate and a glass cover plate which are oppositely arranged, wherein encapsulation parts are arranged between non-display areas of the OLED display substrate and parts of the glass cover plate corresponding to the non-display areas; and each encapsulation part comprises a first concave-convex structure arranged on the OLED display substrate, a second concave-convex structure arranged on the glass cover plate, and encapsulation materials arranged between the first concave-convex structure and the second concave-convex structure. The OLED display panel encapsulation structure, the manufacturing method of the OLED display panel encapsulation structure, and the display device provided by the invention are used for an OLED display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an organic light emitting diode display panel packaging structure, a manufacturing method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) devices are widely used in the display industry due to their advantages of high brightness, full viewing angle, fast response and flexible display. However, since the organic light emitting diode device is very sensitive to water and oxygen in the air, the water and oxygen that penetrate into the organic light emitting diode device will seriously affect the service life of the organic light emitting diode device. Therefore, the organic light emitting diode device needs to use The encapsulation structure is used for encapsulation, so as to block water, oxygen, etc. by using the encapsulation structure. [0003] At present, laser glass encapsulation (Frit encapsulation) is a commonly used encapsu...

AI Technical Summary

Problems solved by technology

[0004] However, the glass barrier is easily broken when subjected to external pressure, and, as the forming material of the glass barrier ages, the adhesion between the glass barrier and the organic light-emitting diode display substrate and the glass cover is also easily reduced, making the glass barrier Cracks appear where the wall overlaps the organic light emitting diode display substrate and glass cover, causing external water and oxygen to penetrate into the organic light emitting diode device, thereby reducing the service life of the organic light emitting diode device

Images