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Pressure measuring device

A technology of measuring device and pressure, applied in the direction of measuring device, measuring fluid pressure, instrument, etc., can solve the problems of the combination of base material and carrier material material for airtight sealing and vitrification, and achieve the decrease of temperature dependence and great flexibility. The effect of improving the measurement accuracy

Active Publication Date: 2017-08-29
EHNDRESS KHAUZER GMBKH KO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the material combinations of base material and carrier material that can produce a hermetically sealed vitrification are limited.

Method used

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Embodiment Construction

[0040] figure 1 A pressure measuring device according to the invention is shown. It comprises a carrier 1 , a base 3 connected to the carrier 1 and a pressure sensor 5 mounted on the base 3 . The pressure sensor 5 is a so-called semiconductor pressure sensor, for example a silicon-based pressure sensor chip, and has, for example, a membrane carrier 7 and a measuring membrane 9 arranged on the membrane carrier 7 , under which the pressure chamber 11 is enclosed.

[0041] The pressure measuring device may be formed as a differential pressure measuring device, as a relative pressure measuring device, or as an absolute pressure measuring device.

[0042] To detect the differential pressure, the first side of the measuring membrane 9 is subjected to a first pressure p 1 , and its second side is subjected to a second pressure p via the pressure transmission line 13 2 ,Such as figure 1 As shown by the dotted line in , the dotted line extends through the carrier 1 , the base 3 and...

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Abstract

The invention describes a pressure measuring device having a carrier (1), a base (3) which is connected to the carrier (1), and a pressure sensor (5) which is mounted on the base (3) and of which the base area is greater than a base area of the base (5), both of the pressure sensors (5) being protected against thermomechanical stresses by an end of the base (3) which is averted from the pressure sensor (5) being adhesively bonded into a recess (17) in the support (1) by means of an adhesive bond (19, 23, 25).

Description

technical field [0001] The invention relates to a pressure measurement device, which has a carrier, a base connected with the carrier, and a pressure sensor installed on the base, the bottom surface of the pressure sensor is larger than the bottom surface of the base. Background technique [0002] Pressure measuring devices are used to measure pressure, especially absolute pressure, relative pressure and differential pressure, and are used in industrial measuring technology. [0003] In pressure measurement technology, so-called semiconductor pressure sensors are commonly used. Silicon-based semiconductor sensors are often manufactured today, for example using silicon-on-insulator (SOI) technology. For example, they are formed as pressure sensor chips generally having a membrane carrier and a measuring membrane arranged on the membrane carrier. [0004] These pressure sensors are very sensitive and are therefore placed in a usually metallic housing and subjected to the pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/14G01L19/04
CPCG01L19/04G01L19/145G01L19/146G01L19/147
Inventor 丹尼尔·希克斯藤森安德烈亚斯·古思雷内·齐尔曼丹尼斯·米勒
Owner EHNDRESS KHAUZER GMBKH KO KG