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Cutting method capable of lowering influence on scribing quality from test pattern

A technology for testing patterns and cutting methods, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increased risk of chip failure, easy damage to isolation walls, and expensive equipment costs, reducing internal excess. production of waste, reduction of the risk of excess production, wide-ranging effects

Inactive Publication Date: 2017-09-08
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, optimizing the dicing parameter method can reduce the occurrence of test pattern chipping, but it will not completely eliminate the chipping phenomenon; avoiding the test pattern scribing method increases the size of the chip, and at the same time, the dicing knife The position is closer to the isolation wall of the chip, the isolation wall is easily damaged, and the risk of chip failure increases; the laser ablation scribing method is expensive, and the high heat generated during the scribing process may affect the quality of the chip. For some integrated circuit products required by the national military standard, the laser ablation scribing method is prohibited

Method used

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  • Cutting method capable of lowering influence on scribing quality from test pattern
  • Cutting method capable of lowering influence on scribing quality from test pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Put an 8-inch wafer with a thickness of 380 μm into a film mounter, and attach a film to the wafer with a film thickness of 80 μm. The reserved width of the scribe lane is 40 μm.

[0032] (2) Put the film-coated wafer into a dicing machine for double-knife scribing. The first dicing knife is a diamond blade with a blade length of 820 μm and a blade thickness of 28 μm. The size is 3 μm, the scribing depth is 70 μm, and the rotation speed of the scribing knife is 31000 rpm. The second scribing knife is a diamond blade with a blade length of 670 μm and a blade thickness of 24 μm. The average size of the diamond on the blade is 4 μm, the cutting depth is 340 μm, and the scribing knife rotates at 33500 rpm.

[0033] (3) Clean and dry the diced wafer by using a dicing machine cleaning table with a rotating speed of 1100 rpm, and remove silicon powder and water droplets remaining on the chip after dicing.

Embodiment 2

[0035] (1) Put an 8-inch wafer with a thickness of 400 μm into a film mounter, and attach a film to the wafer with a film thickness of 100 μm. The reserved width of the scribe lane is 45 μm.

[0036] (2) Put the film-coated wafer into the dicing machine for double-knife dicing. Wherein the first scribing knife is a diamond blade, the length of the blade is 890 μm, the thickness of the blade is 30 μm, the average size of the diamond on the blade is 4 μm, the cutting depth is 80 μm, and the speed of the scribing knife is 32000 rpm. The second dicing knife is a diamond blade with a blade length of 700 μm and a blade thickness of 26 μm. The average size of the diamond on the blade is 6 μm, the cutting depth is 350 μm, and the dicing knife rotates at 35,000 rpm.

[0037] (3) Clean and dry the diced wafer by using the cleaning table of the dicing machine to remove the silicon powder and water droplets remaining on the chip after dicing, wherein the cleaning table rotates at 1200 rp...

Embodiment 3

[0039] (1) Put an 8-inch wafer with a thickness of 350 μm into a film mounter, and attach a film to the wafer with a film thickness of 70 μm. The reserved width of the scribe lane is 38 μm.

[0040] (2) Put the film-coated wafer into the dicing machine for double-knife dicing. Wherein the first scribing knife is a diamond blade, the length of the blade is 760 μm, the thickness of the blade is 26 μm, the average size of the diamond on the blade is 2 μm, the cutting depth is 60 μm, and the speed of the scribing knife is 30000 rpm. The second scribing knife is a diamond blade with a blade length of 625 μm and a blade thickness of 22 μm. The average size of the emery on the blade is 2 μm, the cutting depth is 330 μm, and the scribing knife rotates at 32000 rpm.

[0041] (3) Clean and dry the diced wafer by using a dicing machine cleaning table with a rotating speed of 1000 rpm, remove silicon powder and water droplets remaining on the chip after dicing, and obtain a diced wafer. ...

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Abstract

The invention discloses a cutting method capable of lowering influence on scribing quality from a test pattern. According to the method, a first scribing knife with relatively high thickness and relatively low rotating speed is adopted to perform scribing and cutting on the test pattern on a wafer scribing channel; and then a second scribing knife with relatively narrow thickness and relatively high rotating speed is adopted to perform scribing and cutting on a wafer. By adoption of the method, the test pattern on the wafer scribing channel can be effectively removed by cutting, so that a wafer chipping phenomenon in the test pattern scribing and cutting process can be avoided; and meanwhile, risk of generation of remainders in an integrated circuit can be lowered, the technological cost is low, and the application range is wide.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging and dicing technology, and relates to a cutting method for reducing the influence of test patterns on dicing quality. Background technique [0002] The high integration and high density of integrated circuits promote the continuous development of IC chips in the direction of thinner and smaller, and the technical requirements for chip processing are therefore continuously improved. Dicing is the first process of integrated circuit packaging. With the reduction of chip size and thickness and the reduction of wafer scribing lane width, the impact of scribing process on chip quality is becoming more and more prominent. A good scribing process plays a very important role in ensuring the quality and reliability of integrated circuits. Phenomena such as chip breakage caused by slicing seriously affect the quality of the chip and increase the risk of integrated circuit failure. Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L21/304
CPCH01L21/78H01L21/3043
Inventor 冯小成徐璟贺晋春荆林晓吴玥冯邢杰
Owner BEIJING MXTRONICS CORP