probe

Abstract

An object of the present invention is to provide a probe capable of increasing the density of electronic components to be measured relative to a circuit board. The probe (1) is a probe capable of measuring multiple sites simultaneously. In addition, the probe (1) includes: a plurality of main body parts (30), which include a center conductor (20) in contact with the connector (300); and a first member (50), which connects the plurality of main body parts (30) bundled together. The first member (50) is provided with a concave portion (C1) from which the ends of the plurality of center conductors (20) protrude from the bottom surface. The recess (C1) has an inclined surface (S1) extending from the bottom toward the opening.

Description

technical field [0001] The present invention relates to probes used for measurement of electronic components. Background technique [0002] In recent years, communication terminals that can handle multiple frequencies are becoming mainstream. Such a communication terminal has a plurality of RF circuits, and each RF circuit is connected to an antenna module. In addition, each RF circuit has a connector for connection to the antenna module. Here, in checking the operation of the RF circuit of the communication terminal, a plurality of RF circuits are operated simultaneously, and the operation is confirmed by pressing a probe against each connector. Furthermore, the probe described in Patent Document 1 (hereinafter, referred to as a conventional probe) is known as a probe used for checking the operation of the RF circuit and the like. [0003] However, as described above, current communication terminals have a plurality of RF circuits, and have connectors for connection with...

AI Technical Summary

Problems solved by technology

That is, the inspection of circuit boards using conventional probes has become an obstacle to the miniaturization and high density of the circuit boards.

Images